Dimensity Auto covers a portfolio of solutions in four directions, including the Dimensity Auto cockpit platform, Dimensity Auto connectivity platform, Dimensity Auto driving platform, and Dimensity Auto key components.

The Dimensity Auto Cockpit Platform is based on advanced processes, high computing power and low power consumption, an integrated high-performance AI processor, deep learning gas pedal (MDLA) and vision processing unit (MVPU), flexible AI architecture and high scalability. The ISP image processor supports 16 camera accesses and generates HDR-quality video, and the platform provides high-fidelity audio through the HiFi5 DSP digital signal processor.

The Dimensity Auto connectivity platform solution offers high integration and interoperability, as well as high performance and low power consumption: 5G Sub-6GHz support provides highly reliable network connectivity, greater cellular network bandwidth and high speed through multi-carrier aggregation technology. Wi-Fi 7 supports MediaTek’s proprietary Hardware Offload Technology. Highly interoperable coexistence of multiple wireless network standards, including Wi-Fi and Bluetooth parallel anti-interference, Wi-Fi and 5G cellular network exclusive protocols, etc., allowing high-speed, stable and reliable network connections in and out of the car. Support multi-frequency GNSS global satellite navigation system, more accurate positioning.

The Dimensity Auto driving platform is equipped with the AI processor MediaTek APU, designed to provide a mature solution for smart driving.

Last but not least, Dimensity Auto key components provide diverse core technology and product portfolio for the automotive industry, including power management chips, screen driver chips, GNSS global satellite navigation system, camera ISP, etc., providing key component solutions for the automotive industry in the long term and Dimensity automotive-grade chipsets for the next generation of smart cars.

The post MediaTek released Dimensity Auto car platform, which supports 5G Sub-6GHz, Wi-Fi 7 appeared first on TechGoing.

In May, Qualcomm said that Wi-Fi 7 chips were already shipping to customers and that end products were expected to be available by the end of this year, with significant shipments due in 2023. Wi-Fi 7 penetration is expected to reach 10% by 2023-2024.

MediaTek has also launched its first Wi-Fi 7 chips on a 6nm process, offering a comprehensive platform that “combines Wi-Fi 7 with powerful APs and NPUs to support maximum Wi-Fi, Ethernet and packet processing performance”.

Intel has also previously demonstrated Wi-Fi 7 at speeds in excess of 5Gbps across vendors, based on Core laptops + Broadcom Wi-Fi 7 access points.

Wi-Fi 7 delivers higher speeds, lower latency, higher reliability and greater capacity, including the use of 320MHz channel bandwidth in unlicensed 6GHz spectrum (double the speed), 4K QAM orthogonal amplitude modulation (20% faster), multi-link operation MLO (improved throughput, link robustness, roaming, interference mitigation and reduced latency), as well as the ability to provide more efficient and reliable service through multiple resource unit (MRU) and perforation to improve channel utilization.

The Wi-Fi 7 standard has not yet been finalized and its product solutions are only half-baked solutions based on the features defined in the IEEE P802.11be draft amendment. Intel reportedly plans to launch Wi-Fi 7-certified products according to the Wi-Fi Alliance certification timeline (2023-2024 timeframe).

The post SoC manufacturers are actively preparing Wi-Fi 7 products and high-end phones expected in 2024 appeared first on TechGoing.