Solidigm D7-P5810 hard drive introduction as follows:

The D7-P5810 uses Solidigm’s proven 144-layer 3D NAND media and is a PCIe 4.0 product.

The latest addition to Solidigm’s high-performance D7 series, the D7-P5810 is designed for high endurance and extreme write-intensive workloads. This ultra-fast storage class memory (SCM) SSD delivers up to 50 disk writes per day for random writes and 65 disk writes per day (DWPD) for sequential writes. Compared with similar products, it can improve the performance of cache, high-performance computing (HPC), data logging, logs, etc. by up to 2 times. More importantly, the cost is less than 20% of non-NAND SCM technology.

The D7-5810 is ideally suited as an accelerator for high-density storage capacity tiers such as QLC SSD storage, and brings significant benefits to the following use cases:

・Metadata/Logs: Place performance-sensitive data such as metadata or logs in SLC SSD to speed up system performance. For example, use SLC SSDs for dedicated write-ahead logs in a Ceph cluster.

・Cache: SLC SSD can act as a write buffer or cache, helping to eliminate performance bottlenecks, significantly improve application performance, and improve TCO.

・Tiered: Data is written to SLC SSD first, resulting in faster commit and subsequent read speeds. After the data is cooled, it is aggregated, compressed, and batch-written to the underlying high-capacity QLC drive (such as the Solidigm D5-P5336) to achieve greater storage space efficiency on this media. In addition, write shaping software such as Cloud Storage Acceleration Layer (CSAL) provides further solutions, allowing the value of QLC SSD in terms of density, TCO and sustainability to be reflected in more workloads.

The D7-P5810 is now available in 800GB (U.2 15mm form factor). The 1.6TB version will be available in the first half of 2024.

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The series of QLC SSDs are available in U.2, E3.S, and E1.L form factors, according to the report. The D5-P5336 is currently shipping in the E1.L form factor with capacities up to 30.72 TB, with subsequent U.2 and E1.L form factors expanding to 61.44 TB later this year.

Modern workloads such as AI and 5G are rapidly reshaping the storage landscape,” said Greg Matson, vice president of strategic planning and marketing at Solidigm. Organizations need inexpensive storage in more places, efficient storage of massive data sets and fast access to data. the D5-P5336 delivers all three – value, density and performance. With QLC, the economics are compelling, storing up to 6x more data than HDDs and 2x more than TLC SSDs, while achieving TLC speeds.”

Notes:

Formerly part of Intel’s storage business, Solidigm is now an independent subsidiary of SK Hynix in the U.S. Headquartered in San Jose, California, Solidigm employs nearly 2,000 people and has offices in 20 locations worldwide.

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As a direct replacement for TLC NAND-based PCIe SSDs, the D5-P5430 QLC SSD is said to reduce the TCO (total cost of ownership) of typical object storage solutions by up to 27%, increase storage density by 1.5x, and reduce energy costs by 18%. In addition, Solidigm’s latest SSDs offer up to 14% higher write life compared to TLC SSDs.

The D5-P5430 series supports 1U and 2U server storage configurations in U.2, E1:

• U.2 15mm 3.84 TB – 30.72 TB
• E1.S 9.5mm 3.84 TB – 15.36 TB
• S 7.5mm 3.84 TB – 30.72 TB

Notes:

Solidigm, formerly part of Intel’s storage business, is now an independent subsidiary of SK Hynix in the U.S. Solidigm is headquartered in San Jose, California, with nearly 2,000 employees and offices in 20 locations around the world.

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Known as the “Independent IT Influencer Event,” Technology Field Day gives company members the opportunity to discuss or disclose information about many different technology sectors. Categories can include data center, cloud and physical storage, and networking, among many others. The conference has been held several times a year since 2009, but Solidigm’s announcement was probably the largest in the event’s history.

The presentation was led by Sun Yuyang, senior product marketing manager, who kicked off the session by explaining the differences between triple-level cell (TLC) and quad-level cell (QLC). She covered the advantages and trade-offs of each method before introducing Solidigm’s new “fourth generation QLC”, which offers significant improvements over previous generations of QLC and even the current TLC.

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For example, Solidigm’s 30.72TB SSD is promising a PBW of about 32PB (Petabyte) of endurance, which uses what the company calls QLC Essential Endurance NAND.

However, it’s QLC Value Endurance NAND will again make possible a 61.44TB drive that is said to offer about 65PB of write endurance, but it should be noted that this is reached during 16KB aligned data or other types of light data writes.

So far, neither of these two types of NAND is suitable for consumer applications, as Solidigm only offers E1, E3 and U.2 forms for them. Regardless, this is already a huge step forward for 3D QLC NAND.

Solidigm hopes that its upcoming drives will be able to replace mechanical drives in the enterprise market segment. On top of that, Solidigm claims that it offers better throughput and latency compared to its competitors, and the first drives with the new 192-layer 3D QLC NAND are expected to be available sometime early next year.

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