From last year’s 12th generation Core, Intel mass-produced the Intel 7 process, the digital equivalent of the friendly process, which is not only the first new process after the renaming of the Intel process, but also the starting point for the next four years to master the 5 generations of CPU processes, respectively Intel 7, Intel 4, Intel 3 and Intel 20A, Intel 18A process.

Against the friendly 7nm process Intel 7 is the main force at present, in addition to the 12 generation Core debut, the end of the 13 generation Core, server-class sapphire rapids are Intel 7 process.

According to Intel, Intel 7 process production processors have shipped more than 35 million.

After Intel 7 is the Intel 4 process, which is Intel’s first EUV process that will increase the performance per watt of its transistors by about 20 percent, and Intel says the process will be ready for mass production in the second half of this year.

The first Intel 4 process is the 14th generation Core Meteor Lake series, which will be available next year, or the first half of the year if it is the fastest.

Intel 4 is followed by Intel 3 process, which will achieve about 18% improvement in performance per watt again on the basis of Intel 4. This generation of process is also the mainstay of Intel’s future foundry offering.

After Intel 3 is Intel 20A and 18A process, these two processes are the first time into the Emi node, can be seen as the Friends of 2nm, 1.8nm level, which 20A in the previous generation of Intel 3 based on the performance per watt to achieve about 15% improvement, 18A in 20A based on the performance per watt and then achieve about 10% improvement.

In addition, these two generations of processes will also debut two breakthrough technologies, namely RibbonFET and PowerVia, of which RibbonFET is Intel’s implementation of Gate All Around transistors, which will be the company’s first new transistor architecture since the pioneering launch of FinFET in 2011.

The technology speeds up transistor switching while achieving the same drive current as a multi-fin architecture, but in a smaller footprint.

PowerVia is Intel’s exclusive and industry-first backside power delivery network, which optimizes signal delivery by eliminating the need for wafer-front power supply wiring.

According to Intel’s news, Intel 3 and 20A, 18A three processes are progressing well, not only not postponed, and even will be ahead of mass production – previously also broke the news to say this, 18A process was originally in 2025 mass production, now can be in the second half of 2024 mass production, the year Intel Will be mass production of 20A and 18A two-generation process at the same time.

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