According to reports, Intel’s new core display has been upgraded from Xe LP to Xe LPG, which doubles the performance per watt of the previous generation Iris Xe core display. In addition, the new generation of core graphics has a higher frequency, and the frequency at the same voltage can directly hit more than 2GHz. The new core display is also optimized for DX12U, supports frame doubling function, and supports the new feature “Out of Order Sampling”.

In addition, Intel also launched a new Xe media engine, which supports up to 8K 10bit HDR video encoding and decoding and supports AV1 encoding.

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i5-1340P core display

As shown in the figure above, the core display of i7-1360P is 96EU, and the GPU frequency can reach 1500MHz; the i5-1340P is 80EU, and the GPU frequency can reach 1450MHz.

For comparison, the current i7-1260P core display is 96EU, and the GPU frequency can reach 1400MHz; the i5-1240P core display is 80EU, and the GPU frequency is 1300MHz.

AMD mobile processor core display has improved significantly in recent years. The current RDNA2 architecture Radeon 680M has 12CU, and its performance is doubled compared to the previous generation Vega core display. The upcoming Ryzen 7000 mobile processor will take it to the next level, equipped with RDNA3 core display, and its performance is expected to increase by 50%.

Intel is expected to adopt a larger core display on the 14th generation Core Meteor Lake mobile processor. It is reported that Meteor Lake’s nuclear display will adopt the Xe-LPG architecture, which is a simplified version of the Xe-HPG architecture of the independent display. It is unclear how many EUs (execution units) the Xe-LPG core display of the 14th generation Core has. The earliest news said that it could reach 192 EUs, but recent news said that there may be only 128 EUs.

Meteor Lake

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So how are the individual units of the 14th generation Core all put together? At the hotchips 34 conferences, Intel announced the specific process for each of the Meteor Lake modules, as follows.

Meteor Lake’s CPU Tile module is produced by Intel 4 process, which is Intel’s first EUV process. From the schematic shown, this 14th generation Core processor is composed of 6P+8E.

The left side of the CPU module is the IOE Tile, which is the IO module previously mentioned, and is manufactured by TSMC’s 6nm process, while there is also a SoC Tile in the middle using TSMC’s 6nm process.

Graphics Tile, also known as the GPU module, is based on TSMC’s 5nm process. The roadmap announced by Intel in February shows that there is a TSMC 3nm process manufacturing, however, the news that Intel canceled most of the 3nm orders came out before, and now it can be confirmed that there is no possibility of debuting TSMC 3nm on the 14th generation Core.

Although the 14 generation Core is mainly the above four modules, but it actually has a Base Tile, this part is using Intel’s 22FFL, that is, 22nm process manufacturing, which is the basis of Intel Foveros packaging technology, and does not affect the processor performance, with 22nm process also has no impact.

The above chart is a labeled version made by the Japanese website PCwatch, which can more clearly see the composition and process level of the 5 modules of the 14th generation Core, with Intel’s own production having mainly 2 parts and TSMC’s foundry accounting for 3 modules.

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Different small chips are very obvious

The 12th and 13th generation Cores are hybrid architecture designs, commonly known as the large core P-core/performance core, plus the small core E core/efficiency core, while the 14th generation Core will add a new “small core” called LP E core, or low-power E core.

However, this low-power E core is separated from the P and E cores, not integrated in the computing chip, but still in the IO chip, so its main role should not be to provide computing power, but to manage the scheduling in standby, hibernation and other low-power states, so that the P and E cores can be completely shut down.

The 14th generation Core H and P series are up to 14 cores, while the U series is up to 12 cores, but this labeling does not seem to include low-power E cores, but 6P+8E, 6P+6E, no clear statement here, and the three-level cache is increased to a maximum of 24MB.

GPU core display, architecture from the current Xe LP upgrade to Xe LPG, still low-power, although it is not clear from Alchemist or the next generation Battlemage, but necessarily stronger graphics performance, the maximum number of execution units from 96 to 128, and the addition of expanded game mode, four-way video decoding mode.

Video output is a pleasant surprise, after the debut of the Arc A series graphics cards DP 2.0, and then upgraded to DP 2.1, also supports HDMI 2.1, eDP 1.4b, HBR3.

The memory supports DDR5-5600, LPDDR5/LPDDR5X-7467, with a maximum capacity of 96GB and 64GB respectively.

For expansion, PCIe 5.0 x8 is allocated to discrete graphics cards, which is of course limited to the H series, three PCIe 4.0 x4 is allocated to SSDs, and twelve PCIe 4.0 is allocated to various peripherals.

Up to four Thunderbolt 4 interfaces are compatible with PCIe 3.0, DP 1.4a, USB4, and USB 3.x at the same time.

Independent USB ports up to 3 USB 3.x, 10 USB 2.0.

The package is still 50×25×1.3mm BGA Type3, and will also integrate IPU 6 image enhancement processing unit, VPU/GNA 3.0 AI acceleration unit.

The 14th generation Core will be released in the second half of 2023.

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