Officially, the latest generation of microSD Express cards utilize the PCIe interface and can reach speeds of up to 1,969 MB/s through the use of the PCIe Gen4 x1 lanes as defined in the recently updated microSD Appendix version 8 specification. This speed increase provides product designers with more storage options, allowing a variety of devices with size constraints that require easy serviceability or scalable storage to achieve SSD-level performance. The SD Association has also announced the availability of SSD-class performance for a variety of devices with size constraints and the need for easy maintenance or scalable storage.

In addition, the SD Association announced four new SD Express speed grades to ensure that the new SD 9.1 specification achieves the minimum Sequential Performance level guarantees, including support for Multi-Stream Access and associated power management and thermal management to ensure consistent performance. 9.1 helps consumers determine the right card for their device, provides manufacturers with new tools to ensure minimum performance levels for SD Express cards, and offers ways to guide consumers on what type of card will ensure the operation of specific applications.

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Just over a year ago, Micron announced plans to invest approximately US$15 billion by the end of this century to build a new factory for cutting-edge memory manufacturing. ISI’s R&D center is located at the same location. Over the life of the project, Micron will directly inject $15.3 billion into the Idaho economy, including $13 billion in direct payments to Idaho businesses. The project will create more than 17,000 new jobs in Idaho, including 2,000 direct Micron jobs, further meeting the need for a diverse, highly skilled workforce.

Boise is home to Micron’s corporate headquarters, a newly expanded Center of Excellence for Technology Innovation, and North America’s only DRAM R&D and manufacturing facility. Nearly two-thirds of Micron’s patents come from Boise team members, more than three patents a day.

Clean room space at the new fab is expected to come online in phases starting in 2025, and DRAM production will continue to increase in the second half of the decade as industry demand grows. Ultimately, the cleanroom space will be 600,000 square feet, equivalent to the size of 10 U.S. football fields, making it the largest single cleanroom ever built in the United States when completed.

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Data from the Semiconductor Industry Association also shows that the sales of the global semiconductor industry continued to decline sharply in April year-on-year, falling to US$39.8 billion, significantly lower than the US$50.9 billion in the same period last year, a year-on-year decline of 21.6%.

However, the report of the Semiconductor Industry Association also shows that the sales of the global semiconductor industry in April increased slightly from the previous month, an increase of 0.3% compared with March.

John Neuffer, president and CEO of the Semiconductor Industry Association, revealed that the global semiconductor market is still in a cyclical downturn, but sales have increased month-on-month for two consecutive months, which may indicate a continued rebound in the next few months.

According to the data from the Semiconductor Industry Association, in April, the sales of semiconductors in Europe, the Americas, the Asia-Pacific and other markets all declined month-on-month, and the sales in the Americas, Asia-Pacific and other markets fell by more than 20% year-on-year.

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The latest report released by the research institute shows that in the third quarter of this year, the global DRAM market size, was down to $18.187 billion, less than the previous quarter of $25.594 billion, a 28.9% decline from the previous quarter.

In the report, the research firm said that the 28.9% YoY decline in the third quarter was the second-largest decline since the global economy suffered a financial crisis in 2008.

From the research firm’s report, the size of the global DRAM market fell sharply year-over-year in the third quarter because of a decline in demand for consumer electronics products, which led to a decline in both shipments and prices, with contract prices expanding to 10-15 percent in the third quarter.

In addition to the decline in demand for DRAM needed for consumer electronics, demand for DRAM for servers, which is relatively stable, also slowed significantly in the third quarter, mainly because buyers began to adjust their inventories.

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According to CCTV reports, most of the memory prices have fallen significantly. Since November last year, memory prices have been falling, merchants said. Memory is mainly composed of controllers and memory chips, and it is the memory chips that determine its price. In the first half of this year, downstream demand fell, but global memory chip shipments still maintained growth. The industry, such as Micron, Hynix, and many other chip makers has issued warnings that the oversupply of chips is intensifying.

Recently TrendForce Tiburon Consulting released a report that NAND Flash is currently in oversupply, the second half of the buyer focus on de-stocking and significantly reducing the purchase volume, and the seller opened a broken plate price to consolidate orders so that the third quarter wafer prices fell by 30%-35%, but all kinds of NAND Flash end products are still weak, the original factory inventory As a result, NAND Flash prices fell to 15%-20% in the fourth quarter.

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