Intel Agilex 7 F-Tile supports networking, cloud and embedded applications, as well as bandwidth-intensive and compute-intensive applications such as IPU (Infrastructure Processor). In addition, the Agilex 7 F-Tile doubles the bandwidth per channel compared to previous-generation Intel FPGAs, helping products deliver higher data throughput while consuming less power while meeting strict form factor constraints.

The Agilex 7 F-Tile is manufactured using Intel’s 10nm SuperFin process technology, which gives customers the flexibility to customize the chip design according to their specific needs. Based on multi-protocol capabilities and support, as well as faster data transmission speeds, Intel helps customers realize new connection topologies in a single device. For example, the Agilex 7 F-Tile offers rich functionality to support optical networking applications from 400 Gbps to 1.6 Tbps, as well as applications such as 25/50G passive optical networking for high-speed broadband applications or broadcast standards such as HDMI and SDI.

With Agilex 7, Intel continues to optimize FPGAs for optical networking, data centers, studios, medical test facilities, and 5G networks.

FPGA (Field Programmable Gate Array) is a further development product based on programmable devices such as PAL (Programmable Array Logic) and GAL (General Array Logic). It emerged as a semi-custom circuit in the field of application-specific integrated circuits (ASIC), which not only solves the shortcomings of custom circuits, but also overcomes the shortcomings of the limited number of original programmable device gates. The FPGA itself forms a typical integrated circuit in a semi-custom circuit, containing digital management blocks, embedded cells, output cells, input cells, etc.

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