As previously revealed in the news, the AMD B650E chipset and X670E positioning, although different, but are the main “Extreme”, can support dual PCIe Gen5 protocol for graphics and storage. For the non-E series, the X670 and B650 will only support one of the graphics or storage (PCIe slots or M.2 slots to be exact).

Unlike the X670 series, the B650E will come with a Promontory 21 chipset that will shrink the number of PCIe lanes.

While AMD was previously rumored to be working on another B650 chipset, the Extreme model has only appeared in leaks so far. This new PPT finally confirms that AMD is indeed bringing at least four different chipsets to its AM5 platform.

Later today, AMD will announce new details on its Ryzen 7000 series and possibly on the AM5 platform itself, though the B650 motherboard is not expected to debut next month, but rather a bit later than the other three series.

The new AMD Socket AM5 platform features a new 1718-pin LGA design that supports processors with up to 170W TDP, dual-channel DDR5 memory and new SVI3 power infrastructure. AMD Socket AM5 also features PCIe 5.0 lanes with up to 24 of them.

According to AMD’s official website, the AM5 series motherboards are divided into three main series: ・ X670 Extreme: Provides PCIe5.0 support for two graphics slots and one memory slot.

・X670 Extreme: PCIe5.0 support for two graphics slots and one memory slot, bringing powerful connectivity and higher overclocking performance

・X670: PCIe5.0 support for one memory slot and one graphics slot (with PCIe5.0 support for the graphics slot optional), designed for enthusiast overclockers

・B650: With PCIe 5.0 support for memory slots, designed for high-performance users.

The post AMD B650E motherboard chipset revealed, and X670E also supports PCIe 5 graphics and SSD appeared first on TechGoing.

Over the past 15 years, high entropy alloys (HEAs) have become increasingly popular as a new paradigm in materials science. They consist of five or more elements in nearly equal proportions, providing alloy design with the ability to create a nearly infinite number of unique combinations. Traditional alloys, such as brass, stainless steel, carbon steel and bronze, contain a combination of one major element with one or more trace elements.

3D printing, also known as additive manufacturing, has recently emerged as a powerful approach to materials development. Laser-based 3D printing can produce large temperature gradients and high cooling rates that are unattainable with traditional routes. However, “the potential to leverage the combined benefits of additive manufacturing and HEA to achieve new properties remains largely unexplored,” said Ting Zhu.

Wen Chen and his team in the UMass Multiscale Materials and Manufacturing Laboratory have combined HEA with the most advanced 3D printing technology, laser powder bed melting, to develop new materials with unprecedented properties. Because the process causes the material to melt and solidify very rapidly compared to traditional metallurgical processes, “you get a very different microstructure that is far from equilibrium,” Chen said. This microstructure looks like a web of alternating layers of nano-stellar structures called face-centered cubic lattices (FCC) and body-centered cubic lattices (BCC), embedded in microscopic eutectic clusters with random orientations. The hierarchical nanostructured HEA makes cooperative deformation of the two phases possible.

This unusual microstructural rearrangement of atoms produced ultra-high strength as well as enhanced ductility, which is uncommon because normally strong materials tend to be brittle,” said Chen. Compared to conventional metal casting, we get almost three times the strength, and not only do we not lose ductility, but we actually increase ductility at the same time. For many applications, the combination of strength and ductility is key. Our findings are original and exciting for both materials science and engineering.”

“The ability to produce high-strength and ductile HEAs means that these 3D printed materials are stronger in resisting deformation in applications, which is important for lightweight structural designs that improve mechanical efficiency and energy efficiency,” said Jie Ren, first author of the paper.

Ting Zhu’s group at the Georgia Institute of Technology led the computational modeling for this study. They developed a computational model of biphasic crystal plasticity to understand the mechanical roles played by FCC and BCC nanoparticles and how they work together to increase the strength and ductility of the material.

“Our simulations show a surprising strength and hardening response of the BCC nanoparticles, which is critical to achieve the excellent strength and ductility synergy of our alloy.” Said Ting Zhu, “This mechanistic understanding provides an important foundation to guide the future development of 3D printed HEAs with exceptional mechanical properties.”

In addition, 3D printing provides a powerful tool to manufacture geometrically complex and customized parts. In the future, leveraging 3D printing technology and the vast alloy design space of HEAs offers substantial opportunities for the direct production of end-use parts for biomedical and aerospace applications.

The post First 3D printed high-performance nanostructured alloy combines super strength and ductility appeared first on TechGoing.