Under conventional overclocking methods, DDR5 memory can be overclocked to more than 10,000; if combined with liquid nitrogen, it can be overclocked to more than 11,000.

At the SXSW Sydney event hosted by Intel, many overclocking experts from Team AU Overclocking, including the legendary Hicookie, were present and broke the world record for DDR5 memory frequency with a score of 5809.2 MHz through live broadcast.

This embedded video is below:

The test platform was an Intel i9-14900K processor, a Gigabyte Z790 AORUS Tachyon X motherboard, and a Gigabyte DDR5-8333 with 16GB of memory. The 5809.2 MHz result was equivalent to DDR5-11618, which is a bit higher than the previous DDR5-11614 created by the Asus Z790 motherboard.

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In terms of PC DRAM, as the average price of DDR5 has increased in the third quarter, coupled with the stocking up of new CPU models, it is expected that the demand for DDR5 will continue to rise.

TrendForce estimates that DDR4 prices will increase by 0~5% quarter-on-quarter in the fourth quarter of this year; DDR5 prices will increase by approximately 3~8% quarter-on-quarter, and PC DRAM contract prices are expected to increase by 3~8% quarter-on-quarter.

In terms of server DRAM, the proportion of DDR5 buyer inventory has increased to 30~35% from 20% in the second quarter. However, the actual server utilization rate in the third quarter was only 15%. This shows that the market adoption demand is not as expected.

The average price of server DDR4 is expected to remain flat in the fourth quarter, while the average price of server DDR5 is still expected to fall. As the proportion of DDR5 shipments increases, and the price difference between DDR4 and DDR5 is about 50~60%, the average price of comprehensive products will still rise. Retail price (Blended ASP), so the contract price of Server DRAM in the fourth quarter is expected to increase by 3~8% month-on-month.

In terms of mobile DRAM, LPDDR4X or old process products, which currently have a large inventory of original manufacturers, are expected to have contract prices increase by about 3~8% month-on-month; LPDDR5 (X) is slightly in tight supply, and contract prices are expected to increase by 5~10% month-on-month.

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Major DRAM manufacturers such as Samsung and SK Hynix are still cutting production capacity, but the cuts are mainly in DDR4 specifications.

It is reported that PC platforms such as Intel and AMD plan to launch new platforms next year to further promote and popularize DDR5 memory and attract consumers to upgrade from DDR4.

In addition to the consumer market, DDR5 memory is also sought after in the server market. Intel plans to launch the fifth-generation Emerald Rapids server platform before the end of this year. Coupled with the increased demand for AI servers in the future, DDR5 memory is expected to enter a period of rapid growth.

Quoting TrendForce in August this year as reporting that thanks to Intel’s Meteor Lake processors, which only support DDR5 and LPDDR5, DDR5 memory has become more popular and is expected to surpass DDR4 and become mainstream in the second half of 2024. Therefore, the average DRAM capacity is expected to grow by 12.4%.

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According to the report, in the PC sector, the average capacity of DRAM is expected to grow by 12.4%, thanks to the popularization of DDR5 memory driven by Intel’s Meteor Lake processor, which supports only DDR5 and LPDDR5 and is expected to overtake DDR4 as the mainstream in the second half of 2024.

The growth of PC Client SSDs is not as strong as that of PC DRAMs, with the annual growth rate of the average capacity of DRAMs expected to be only about 8~10%. Due to the gradual shift of most consumers’ usage habits to cloud computing, the demand for notebook PCs with high-capacity storage space is decreasing, and even with the increase in 1TB models, 512GB models are still the mainstream of consumption.

As for servers, the average annual growth rate of Server DRAM capacity is estimated to reach 17.3%, which is mainly due to the generation transition of server platforms, increased reliance on RAM matching CPU cores for CSP business, and high demand for AI server arithmetic load.

UFS and eMMC, image storage demand, 5G penetration rate increase, etc., will drive the smartphone average carrying capacity increase, but in the original factory to reduce production to brewing price increases, smartphone OEM cost control will be more cautious, 2024 low-end models 1TB above the planning may be reduced.

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▲ Picture source Pexels

Prices and demand for HBM and DDR5 chips are growing due to surging demand for AI. High-performance memory HBM, which vertically connects multiple DRAMs, is 5-6 times more expensive than existing DRAM products, and the price of the latest DDR5 is also 15%-20% higher than the previous generation DDR4.

SK Hynix currently accounts for less than 1% of the sales volume of HBM products, but the sales accounted for about 10%. If the size of the HBM3 and DDR5 business doubles, it is expected to accelerate revenue growth and improve profits. In view of the fact that SK Hynix is expected to lose more than 6 trillion won in the first half of this year (Note: currently about 33.78 billion CNY), the target setting is also interpreted as the company hopes to achieve performance rebound through the high value-added memory market.

SK Hynix, which previously launched the world’s first 12-layer HBM3 product, said at a briefing that it expects its two product lines, HBM and DDR5, to more than triple in size by 2024.

SK hynix also revealed a specific roadmap for its next-generation products, and they set the production target time of the sixth-generation HBM product HBM4 as 2026. At present, SK hynix has determined the mass production time of its next-generation product HBM3E in the first half of next year.

Technology competition around high-value-added DRAM in the semiconductor industry, including SK Hynix, is expected to intensify. Samsung Electronics plans to start HBM3 production by the end of this year, and plans to invest hundreds of billions of won to double the HBM production capacity at the Chungnam Cheonan plant. Starting in the fourth quarter, Samsung’s HBM3 will also be supplied to Nvidia, a major customer currently monopolized by SK Hynix.

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The data center development laboratory in Seoul, which will be completed and opened by the end of this year, will be responsible for developing DDR5 DRAM memory technology for data centers.

In the Vision 2023 event, Intel also stated that it has set up six more scientific research institutions in the United States, China, India, and Mexico, mainly responsible for researching and certifying server semiconductor chips.

Intel also expanded its cooperation with Samsung and SK Hynix to test and evaluate the performance of next-generation memory products such as DDR5 and Compute Express Link.

It was previously reported that SK Hynix recently announced that its 5th generation 10nm process 1bnm has been verified to meet the next-generation DDR5 and HBM3E solution needs.

Xeon Scalable is certified by Intel to support DDR5 products built on the 1 billion nanometer node, the company said. Samsung has also started mass production of 16Gb DDR5 DRAM using the 12nm process node.

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Anaconda’s new DDR5 memory is divided into standard version and overclocking version. The standard version has 8GB and 16GB DIMMs, the size is 2x8GB and 2x16GB, 4800 MT/s, the timing is CL40, and the operating voltage is 1.1V.

▲ Picture source techpowerup, the same below

The frequency of the overclocking version is 5600/6200/7000 MT/s, the timing is CL36 and CL40, the operating voltage is 1.45V and 1.25V respectively, and there are 16GB and 32GB versions; at the same time, Anaconda also exhibited an overclocking version that supports RGB lighting effects version of.

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According to the report, the gamer is using Chicco’s Trident DDR5-7800 memory, equipped with a ROG Maximus Z790 APEX motherboard. With the support of liquid nitrogen cooling, the DDR5 memory was overclocked to 11202 MT/s with a memory timing of 62-126-126-127-127.

As reported earlier, in April 2022, MSI team was the first to overclock DDR5 memory to 10004 MT / s, breaking the 10000 MT / s mark.

Currently, DDR5 memory on the market starts at DDR5-4800, with high-frequency models such as DDR5-5200, 5600, 6400, etc. The top models currently on sale can reach DDR5-8000.

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Now, the price of this series of memory has dropped significantly:

 Avengers DDR5-5600 48G*2 priced at 2599 CNY

 Avengers DDR5-5600 RGB 48G*2 is priced at 2699 CNY

According to previous reports, the non-binary memory uses 24Gb DRAM chips instead of the current standard 16Gb modules. If 20 24Gb DRAM chips are installed on DIMMs, after considering the capacity of ECC and metadata, 48GB of usable memory can be obtained.

For some motherboards with only two memory slots, 48GB2 has 32GB more capacity than the original maximum of 32GB2. At present, the latest motherboard platforms of Intel and AMD already support a single memory of 24GB and 48GB.

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At present, Intel 12/13 generation Core entry motherboard only has H610 models, H710 has not been launched so far. The H610 motherboard for sale in Jingdong is priced between RMB 300 and RMB 700 and is basically a DDR4 model.

With the price of DDR5 memory dropping significantly, the launch of the H610 D5 motherboard version is also the trend. This series of motherboards equipped with 12/13 generation i3 or i5 processors will be a good choice for general office and audio/video purposes.

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