Today, MinisForum officially showed off the new V3 AMD tablet. It’s a versatile 3-in-1 Windows device powered by AMD’s high-performance CPU.

According to reports, it can be turned into a laptop, tablet or portable display, with a 14-inch 2.5K 165Hz display.

This computer uses a USB Type-C input interface, and you can connect it to a phone to turn it into an external phone display, supporting the latest Apple iPhone 15 series.

As for the CPU, MinisForum has confirmed that it will use AMD Hawk Point APU, running between 22~28W. This architecture represents an improvement of the Phoenix architecture and integrates the latest AMD Zen4 CPU architecture and RDNA3 GPU architecture.

This series of APUs is commonly seen in handheld devices such as ROG Ally and Legion Go, but this three-in-one computer only uses the most standard APU model, not the Ryzen Z1 gaming model.

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According to reports, this series of processors adopts dual CCX design, with a 4-core 8-thread specification Zen 5C core and 8-core 16-thread Zen 5D core, the L3 cache is 16+8=24MB, and the core display has 8 groups of WGP, i.e. 16CU.

According to 9550pro, the C in Zen 5C stands for Classic and the D in Zen 5D stands for Dense.

Overseas blogger “Moore’s Law is dead” also broke similar content, said AMD’s new generation of 12-core APU code-named SRTIX, using the N4 process, Monolithic monolithic chip design, is expected to launch in the second quarter of next year or the third quarter of next year.

In addition, AMD will also launch SRTIX HALO APU in the fourth quarter of next year, Chiplet dies design, the number of cores increased to 16 cores, the core display upgraded to 40CU, the memory bit width has also been upgraded to 256bit, the power consumption of 25-120W.

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According to the relevant information shared by Moore’s Law Is Dead, AMD’s next-generation APU chip code-named “Strix Point” has 2 types of SKUs. The attached list is as follows:

 Up to 12 Zen 5/5c Cores, 16 Compute Units RDNA 3+ iGPU

 Up to 16 Zen 5 cores, 40 Compute Units RDNA 3.5 iGPU

MLID says the Strix Point APU is based on a 4nm process with a die size of “over 200 mm2” and a package cost comparable to a “Granite Ridge” desktop Zen 5 CPU.

MLID said that the AM5 Strix Point APU has no cost advantage over the desktop Zen 5 CPU, and the key selling point of the desktop Ryzen 8000 Strix Point is likely to be the iGPU.

The news also said that the Zen 5c core will cause a drop in game performance due to TDP limitations, so the desktop Ryzen 8000 APU only contains the Zen 5 core.

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RedGamingTech reveals that each CCD can hold up to 8 cores and up to 16 cores. The CCD is codenamed “Eldora” and the individual cores inside the CCD are called “Nirvana.

RedGamingTech revealed that the Zen 5 can provide 80KB of L1 cache, compared to the Zen 4’s 64KB L1 cache. Each core has 1MB of L2 cache and each CCD has 32MB of L3 cache.

The leak that the Zen 5 has a default TDP of 170 W, the same as the current Zen 4 flagship products, Ryzen 9 7900X and Ryzen 9 7950X.

The accelerated clock frequency of Zen 5 CPU is 300 MHz higher compared to Ryzen 9 7950X (5.7GHz) and can reach 5.8-6 GHz with an average 19% increase in IPC.

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The new roadmap lists the Riptide 8000 series processors with Zen5 and Navi 3.5 architectures, which AMD has never officially mentioned for a product before.

There are rumors that AMD’s next-generation APU chips, codenamed “Strix Point,” will use the RDNA3.5 architecture with 16 or 40 CUs, and the roadmap will confirm that such products can also be used in desktop processors.

AMD also mentions the Ryzen 7000 desktop processor with Zen4 and Navi 3.0, but currently, the Ryzen 7000 series only uses the RDNA2 architecture.

This means that AMD is preparing new processors with Navi 3.0 (aka RDNA3), which could arrive later this year. When it comes to Navi 3.0, I believe your first thought should be the Phoenix APU currently used in high-end laptops, but there are only a few models listed with this series of processors.

AMD also mentioned that it will launch three different versions of its next-generation CPU cores: Zen5, Zen5c and Zen5 with 3D V-Cache, which will reportedly be built on 4nm and 3nm nodes.

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According to AMD’s expectations, this series of processors may include a number of cores ranging from 6 to 16, TDP from 65 to 170W, and will be equipped with a maximum of 16MB L2 cache as well as 64MB L3 cache.

If we just look at these specifications, the next generation of the Ryzen 8000 series can be said to be very similar to the 7000 series, and this is supported by the previously leaked AMD roadmap.

Although there is no increase in the number of cores, the new Zen 5 architecture ushers in significant improvements in speed and efficiency compared to its predecessors. Of course, this is largely due to TSMC’s state-of-the-art N3E or N3P nodes, which are expected to provide up to 18% performance gains while reducing power consumption by 34%.

These are only AMD’s expected indicators, after all, the processor series will not be released until the second half of 2024, so there are still many variables.

In addition, the foreign media also revealed the key details of AMD desktop processors. AMD Ryzen 8000 desktop processors will allegedly feature the Zen 5 CCD (Eldora) as well as the Zen 5 CPU core (Nirvana).

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