AMD CDNA 3 Archives - TechGoing https://www.techgoing.com/tag/amd-cdna-3/ Technology News and Reviews Fri, 16 Jun 2023 07:00:18 +0000 en-US hourly 1 https://wordpress.org/?v=6.4.4 AMD confirms Instinct MI300X GPU TBP is 750W https://www.techgoing.com/amd-confirms-instinct-mi300x-gpu-tbp-is-750w/ Fri, 16 Jun 2023 06:57:30 +0000 https://www.techgoing.com/?p=106638 AMD demonstrated the latest Instinct MI300X GPU at the data center and AI technology premiere held on Tuesday. AMD did not disclose too many details in the keynote speech, and Hoang Anh Phu later found that the MI300X (192 GB HBM3, OAM module) TBP is 750 W, while the previous generation MI250X TBP is only […]

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]]> AMD demonstrated the latest Instinct MI300X GPU at the data center and AI technology premiere held on Tuesday. AMD did not disclose too many details in the keynote speech, and Hoang Anh Phu later found that the MI300X (192 GB HBM3, OAM module) TBP is 750 W, while the previous generation MI250X TBP is only 500-560 W.

It was previously reported that the MI300X is a pure GPU version that uses AMD CDNA 3 technology and uses up to 192 GB of HBM3 high-bandwidth memory to accelerate large language models and generative AI calculations.

Designed for large language models and other advanced AI models, the MI300X and its CDNA architecture pack together 12 5nm chiplets for a total of 153 billion transistors.

This new AI chip ditches the APU’s 24 Zen cores and I/O chips in favor of more CDNA 3 GPUs and a larger 192GB HBM3, delivering 5.2 TB/s of memory bandwidth and 896GB/s of unlimited bandwidth .

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]]> AMD Instinct MI300 APU successfully running with Zen 4 and CDNA 3 architecture https://www.techgoing.com/amd-instinct-mi300-apu-successfully-running-with-zen-4-and-cdna-3-architecture/ Fri, 02 Dec 2022 09:52:23 +0000 https://www.techgoing.com/?p=51718 AMD Chief Technology Officer Mark Papermaster said at Wells Fargo’s 6th TMT Summit in 2022 that the company’s next-generation Instinct MI300 accelerated processing unit for data centers and high-performance computing has been implemented in AMD’s Up and running in the lab. The AMD Instinct MI300 APU adopts AMD’s Zen 4 and CDNA 3 architecture and […]

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]]> AMD Chief Technology Officer Mark Papermaster said at Wells Fargo’s 6th TMT Summit in 2022 that the company’s next-generation Instinct MI300 accelerated processing unit for data centers and high-performance computing has been implemented in AMD’s Up and running in the lab.

The AMD Instinct MI300 APU adopts AMD’s Zen 4 and CDNA 3 architecture and will be used in the El Capitan supercomputing in the United States. The supercomputing is expected to be put into use in 2024, and the FP 64 peak computing performance will exceed 2 ExaFLOPS.

AMD’s Instinct MI300 is a multi-chip APU featuring Zen 4 general-purpose x86 cores and a CDNA 3-based compute GPU that share a unified pool of packaged memory, including Infinity Cache cache and HBM shared memory design. AMD will use TSMC’s N5 (5nm-class) manufacturing process to produce CPU/GPU chipsets for the MI300, but the company did not disclose the number of CPU cores and GPU stream processors for the Instinct MI300.

Papermaster also revealed that AMD is expected to launch an EPYC Bergamo processor competing with Arm servers such as the AWS Graviton series in the first half of 2023, using the Zen 4C architecture.

AMD EPYC Bergamo processors will feature up to 128 cores and will be optimized for HBM-powered Xeon chips, as well as server products from Apple, Amazon and Google, using the SP5 socket, optimized for higher-throughput workloads.

Additionally, the AMD Genoa-X CPU, expected to be in production late Q3/early Q1 2023 and to launch around mid-2023, will feature a similar architecture to the Milan-X chip with 3D V-Cache design method. The Genoa-X CPU will be equipped with more than 1GB of L3 cache and up to 96 cores based on the Zen 4 architecture.

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