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The latest news shows that Sony has completely changed the internal design of its PS5. According to previous news, the machine has been available in some markets on September 15.

As it turns out, the new version not only upgrades the internals, including a new motherboard, and a smaller and lighter cooler but also switches to a newer chip for the console.

According to Angstronomics, the third-generation PS5 console, codenamed “CFI-1202,” is equipped with a smaller SoC called “Oberon Plus.

The SoC is built using TSMC’s 6nm process, the same generation as the 7nm node that has been used in Sony’s PS5 “Oberon” SoC.

That is to say, the underlying Zen2 CPU and RDNA2 GPU parts remain unchanged.

Gad

▲ Oberon Plus (left), Oberon (right), source: Angstronomics

Oberon Plus has exactly the same design and specifications as the 7nm Oberon, but with a smaller chip and lower power consumption, which has shrunk to 260mm² compared to the original 300mm², so the new version of PS5 will accordingly only need a slightly lesser cooling solution.

For AMD and Sony, this also means they can use a wafer to make more chips, so the production cost of the new version of the console may be reduced a little. Not surprisingly, the Xbox series, also based on the 7nm AMD SoC, will also be updated to a 6nm design in the future.

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Threza Gabriel
Threza Gabrielhttps://www.techgoing.com
TechGoing is a global tech media to brings you the latest technology stories, including smartphones, electric vehicles, smart home devices, gaming, wearable gadgets, and all tech trending.
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