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Japan to spend 350 billion yen on next-generation semiconductor development research cooperation

Japan plans to budget 350 billion yen (about 17.15...

GSMA: 5.5G expected to be first commercialized in 2024, with 10x faster network speeds

At the recent 2022 Global Mobile Broadband Forum "5.5G...

ASUS Announces New Wi-Fi 6E PCIe Adapter Card Supporting AX3000 Specification

According to TechPowerUp, Asus has launched the PCE-AXE59BT WLAN...

Sony will eliminate plastic packaging for products such as cell phones and headphones

According to Nikkei News, Sony will start next year to eliminate plastic packaging in cell phones and headphones.

Sony will reportedly eliminate plastic packaging for small products weighing 1 kg or less, such as smartphones, cameras and audio accessories, starting in fiscal 2023. This will cover 40% of Sony’s products shipped in fiscal 2021.

Sony is working to achieve a zero environmental footprint by 2050 by not using plastic packaging in its latest designs of small products, and the Sony Xperia PRO-I is the first Xperia smartphone to achieve zero plastic packaging for a single product.

In addition, Sony is changing the outer packaging of existing headset models from plastic to paper products, and the outer packaging of the MDR- EX15AP has been redesigned to reduce the total amount of plastic used from approximately 96% to less than 5%.

Sony also recently launched a new LinkBuds S headphones made from recycled water bottle material, named “Earth Blue” color scheme, the headphones have a unique appearance, the color resembles cream blue, and are embellished with light-colored swirls as if made of marble.

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Xiaomi Redmi K60 SE passes 3C certification, powered by Dimensity 8200 chip

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Threza Gabriel
Threza Gabrielhttps://www.techgoing.com
TechGoing is a global tech media to brings you the latest technology stories, including smartphones, electric vehicles, smart home devices, gaming, wearable gadgets, and all tech trending.
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Vivo X90 series took the Dimensity 9200 BOE Q9 high-division screen

The new Dimensity 9200, Snapdragon 8 Gen2 flagship chip, and a host of other top flagships equipped with the chip will debut one after...

AMD Announces FSR 3 and Hyper-RX Technology Coming to PC in 2023

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Xiaomi launches USB-C 5-in-1 docking station for 149 CNY

Xiaomi's new USB-C 5-in-1 docking station is now available for 149 CNY. The docking station can be extended to 3 USB-A 3.0 ports, one USB-C...