SK Hynix revealed in its recent Q2 earnings call that it plans to complete 238-layer NAND pilot production during the year and achieve mass production in the first half of 2023.
In response to Micron’s recent mass production of 232-layer NAND, Hynix said that the pace of product releases varies from vendor to vendor, and that the storage market should now focus on improving profitability, with Hynix aiming to achieve the highest level of profitability in the industry.
The company also said that it plans to achieve 70% of its main product, 176-layer 4D NAND, in wafer form by the end of this year to further improve gross margins.
In response to the DRAM market, Hynix said that although the current average selling price (ASP) of DRAM is low, the decrease in cost is sufficient to compensate for the change in ASP, and the company expects DRAM shipments to increase by about 10% and NAND flash shipments to increase by 20% this year.
