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SK Hynix announces 8th-Gen 3D NAND: Over 300 layers stacked to improve SSD performance

SK Hynix recently announced the details of the eighth-generation 3D NAND, with more than 300 stacked layers, and is expected to be on the market by the end of 2024 or early 2025.

It is learned from SK Hynix’s official announcement that the 8th generation 3D NAND stack has matured to more than 300 layers, has a capacity of 1Tb (128GB), has three-level cells and a bit density of more than 20Gb/mm^2 (bit density).

The chip has a page size of 16KB, 4 planes, an interface transmission speed of 2400MT/s, and a maximum throughput of 194MB/s (18% faster than the 7th generation 238-layer 3D NAND).

Nearly doubling the bit density of the new NAND would mean a significant increase in per-wafer productivity for the new manufacturing node, and would also lower costs for SK Hynix, though it’s not clear how much.

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Threza Gabriel
Threza Gabrielhttps://www.techgoing.com
Threza Gabriel is a news writer at TechGoing. TechGoing is a global tech media to brings you the latest technology stories, including smartphones, electric vehicles, smart home devices, gaming, wearable gadgets, and all tech trending.

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