According to the latest process technology roadmap announced by Samsung Foundry at the annual Samsung Foundry Forum (SFF 2023) today, the company plans to launch a 2-nanometer SF2 process in 2025, 1.4 nanometer SF1.4 process will be launched in 2027. At the same time, the company also announced some characteristics of the SF2 process.
Samsung’s SF2 process is further optimized on the basis of the third-generation 3nm-scale (SF3) process introduced earlier this year. Compared with SF3, the SF2 process can improve power efficiency by 25% at the same frequency and complexity, improve performance by 12% at the same power consumption and complexity, and reduce 5% at the same performance and complexity area. In order to make the SF2 process more competitive, Samsung will also provide a series of advanced IP combinations for the process, including LPDDR5x, HBM3P, PCIe Gen6 and 112G SerDes, etc.
Following SF2, Samsung will launch SF2P optimized for high-performance computing (HPC) in 2026, and SF2A optimized for automotive applications in 2027. Also in 2027, the company plans to start mass production using the SF1.4 (1.4 nanometer scale) manufacturing process. Samsung’s 2nm process will be roughly in sync with TSMC’s N2 (2nm) process, and about a year behind Intel’s 20A process.
It is noticed that in addition to continuously improving its own process technology, Samsung OEM also plans to continue to develop its radio frequency technology. The company expects its 5nm RF process technology to be ready in the first half of 2025. Compared with the old 14nm RF process, Samsung’s 5nm RF process is expected to improve power consumption efficiency by 40% and increase transistor density by about 50%. In addition, Samsung will start producing gallium nitride (GaN) power semiconductors in 2025 for various applications including consumer goods, data centers and automotive fields.
In terms of expanding technology supply, Samsung Foundry remains committed to expanding its manufacturing capabilities in Pyeongtaek, South Korea, and Tyler, Texas, USA. Samsung plans to start mass-producing chips at its Pyeongtaek 3 production line (P3) in the second half of 2023. The new Taylor City facility is expected to be completed by the end of this year and begin operations in the second half of 2024. Samsung’s current plan is to increase its cleanroom capacity by 7.3 times by 2027 compared to 2021.
