Samsung Electronics announced yesterday that it has developed its first 7.5Gbps (Note: 0.9375GB/s) low-power compressed add-on memory module (LPCAMM) form factor and size. With the advantages of compactness and detachability, it will be commercialized in 2024.
After the news was released, foreign media anandtech obtained more detailed information about this LPCAMM memory. The key contents are as follows:
LPCAMM memory is Samsung’s improvement on LPDDR memory using the CAMM specification interface, but the LPCAMM form factor is not compatible with CAMM (either physically or electrically), so despite their similar names, the two are not interchangeable.
▲ Picture source anandtech
With LPCAMM, Samsung places 4×32 LPDDR5X memory die packages directly on the compression connector, allowing the use of a 128-bit memory bus on a single memory module.
From a pad diagram provided by Samsung, we can see that the contacts of the LPCAMM memory are located on the back of the PCB board, corresponding to the positions of the four LPDDR5X memory particles. In other words, the memory particles and contacts are very close, which can minimize the signal transmission distance between the memory controller and the memory chip.
▲ Picture source anandtech
LPCAMM memory measures 78mm x 23mm. In addition to the DRAM package itself, the SPD and power management IC (PMIC) are included underneath the LPCAMM module. Like the CAMM standard, this standard allows modules to provide their own voltage regulation and identification.
For the first generation of LPCAMM memory, Samsung hopes to offer 32GB, 64GB, and 128GB versions with data rates up to LPDDR5X-7500. However, Samsung currently does not have 256Gbit LPDDR5X memory chips, so to achieve a single 128GB, either 8 chips are installed on LPCAMM, or the memory size is increased overall.
Samsung says LPCAMM can take up up to 60% less space on the motherboard than So-DIMM. Not only does this make more efficient use of the device’s internal space, it also improves performance and energy efficiency by 50% and 70% respectively.
This research and development result has been system verified on the Intel platform. Samsung will test LPCAMM in next-generation systems this year with major customers including Intel, with plans to commercialize it in 2024.
As for standardization, according to Samsung, they are working with partners to develop the JEDEC standard for LPCAMM. Meanwhile, JEDEC announced in March that they are also working on extending the CAMM standard to cover LPDDR memory and use the same connector for DDR5 and LPDDR5, but no follow-up news has been announced yet.
