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Samsung is exploring next-generation semiconductor immersion cooling solutions

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Samsung is exploring next-generation semiconductor immersion cooling solutions

Samsung Electronics recently attended the International Electronic Packaging Symposium (ISMP 2023) held in Busan. Hwang Yu-cheol, head of the company’s DS department, delivered a keynote speech and introduced the “immersion cooling” solution. .

Note: Android phones will continue to ship 4nm process chips next year, and Apple’s iPhone 15 Pro series has already adopted 3nm companies. As semiconductor miniaturization reaches its physical limit, people are increasingly interested in packaging technology to improve chip performance.

How to control the heat generated by semiconductors has become a difficult problem for chip manufacturers and phone manufacturers. Compared with the existing air heat dissipation, the immersion heat dissipation proposed by Samsung can significantly reduce heat dissipation power consumption.

Samsung admits that the initial investment cost of this solution is very high at present. It is highly stable and semi-permanent, so it has advantages in many aspects.

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