Most Viewed Content:

Xiaomi Redmi X86 giant screen TV, 4K display + metal body RMB 4999

Xiaomi previously announced the Redmi X86 giant-screen TV. Xiaomi...

Tesla netted 69,000 yuan per car, 8 times that of Toyota

Analysis shows that although Toyota sold more than seven...

Japan to spend 350 billion yen on next-generation semiconductor development research cooperation

Japan plans to budget 350 billion yen (about 17.15...

Samsung is developing new chip packaging technology: bonding wires with aluminum oxide coating

Samsung is developing a new chip packaging technology with its main partners for use in automotive chips, according to TheElec.

The tech giant is developing an aluminum oxide (Al2O3)-coated bond wire technology that offers improved reliability and insulation compared to previous bond wires, the sources said.

Bond wires can connect I/Os with lead frames or printed circuit boards.

Most of them have been made of gold (Au) in the past because the material is flexible and conductive. But as gold prices continue to rise, many companies are trying to mix them with silver (Ag) or copper (Cu).

But these hybrid materials usually have weak adhesion to their coating materials. This is unacceptable for chips aimed at cars, which are exposed to high temperatures and humidity.

The aluminum alternative that Samsung is developing with Electron, NCD and LT Metals does not have these weaknesses.

Alumina is coated in nanometer thicknesses on metals used as wires.

Alumina combines well with insulating coating materials using epoxy resins. Precursors used to coat alumina, such as trimetallic aluminum, are also relatively inexpensive.

Samsung also plans to use atomic layer deposition to deposit aluminum oxide and is testing various thicknesses.

However, challenges remain, such as off-center balls. Traditionally, a ball is formed at the end of the bond wire that connects to the electrodes. The ball must be centered.

Latest

Tesla’s Texas factory starts hiring: preparing for mass production of Cybertruck next year

According to reports, the latest recruitment information shows that...

Arm64 Visual Studio is now officially open to the entire developer community

Microsoft has been continuously working on different projects to...

Nvidia GeForce RTX 4070 Ti, rebranded from RTX 4080 12 GB, may launch on January 5

According to Wccftech, NVIDIA's upcoming GeForce RTX 4070 Ti...

Google launches series of cross-platform features for fans to follow FIFA World Cup

Google is rolling out a series of updates across...
spot_img

Newsletter

Don't miss

Tesla’s Texas factory starts hiring: preparing for mass production of Cybertruck next year

According to reports, the latest recruitment information shows that...

Arm64 Visual Studio is now officially open to the entire developer community

Microsoft has been continuously working on different projects to...

Nvidia GeForce RTX 4070 Ti, rebranded from RTX 4080 12 GB, may launch on January 5

According to Wccftech, NVIDIA's upcoming GeForce RTX 4070 Ti...

Google launches series of cross-platform features for fans to follow FIFA World Cup

Google is rolling out a series of updates across...

Nvidia GeForce RTX 4080 is 20-30% slower than RTX 4090 but still beats RTX 3090 Ti

Benchmark data for NVIDIA's upcoming GeForce RTX 4080 (previously...
spot_imgspot_img

Samsung Galaxy A33 5G phone opens Android 13 / One UI 5.0 internal testing

Now that Samsung has rolled out the One UI 5.0 public update for the Galaxy S22, S21, S20, Galaxy Note 20, and even the...

Render of what could have been the first Android phone revealed: horizontal slider with a full-size keyboard

On November 3, I believe most people know that the first Android phone is HTC Dream, also known as T-Mobile G1, which was launched...

Zotye Automobile received a letter of concern: to clarify if the news about power battery technology is true

Today, Shenzhen Stock Exchange issued a letter of concern to Zotye Auto, requesting that the company will comprehensively deploy vehicle production, power batteries, important...