Samsung Electro-Mechanics (Semco) recently announced that it is increasing its investment in FCBGA packaging substrate production lines in Korea and Vietnam. According to a press release, Samsung Electro-Mechanics will invest an additional KRW 300 billion (approximately RMB 1.548 billion) to expand the company’s FCBGA substrate capacity in Vietnam and in Busan and Sejong, South Korea.
Samsung Electro-Mechanics said it wants to further strengthen its position as one of the top three global suppliers of IC substrates and plans to mass-produce high-end ABF substrates for server applications within this year. “Next-generation substrate technologies such as SoS (System on Substrate) will be a game-changer in the future IT environment where artificial intelligence technologies such as robotics, meta-border, and autonomous driving are expanding,” said Chang Duckhyun, CEO of Samsung Electro-Mechanics.
In December 2021, Semco disclosed a total investment of $850 million to establish FCBGA production facilities and infrastructure for its manufacturing facility in Vietnam. The investment will be executed in phases until 2023.