Home News Samsung invests an additional RMB 1.548 billion to increase its FCBGA substrate capacity in Korea and Vietnam

Samsung invests an additional RMB 1.548 billion to increase its FCBGA substrate capacity in Korea and Vietnam

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Samsung invests an additional RMB 1.548 billion to increase its FCBGA substrate capacity in Korea and Vietnam

Samsung Electro-Mechanics (Semco) recently announced that it is increasing its investment in FCBGA packaging substrate production lines in Korea and Vietnam. According to a press release, Samsung Electro-Mechanics will invest an additional KRW 300 billion (approximately RMB 1.548 billion) to expand the company’s FCBGA substrate capacity in Vietnam and in Busan and Sejong, South Korea.

Samsung Electro-Mechanics said it wants to further strengthen its position as one of the top three global suppliers of IC substrates and plans to mass-produce high-end ABF substrates for server applications within this year. “Next-generation substrate technologies such as SoS (System on Substrate) will be a game-changer in the future IT environment where artificial intelligence technologies such as robotics, meta-border, and autonomous driving are expanding,” said Chang Duckhyun, CEO of Samsung Electro-Mechanics.

In December 2021, Semco disclosed a total investment of $850 million to establish FCBGA production facilities and infrastructure for its manufacturing facility in Vietnam. The investment will be executed in phases until 2023.