More information has emerged about the supply chain for Samsung’s Galaxy S23 components. Reports say that Samsung is replacing one of its existing HDI PCB (High-Density Interconnect Printed Circuit Board) suppliers due to an acquisition outside of its control.
Samsung and Japanese HDI board supplier Ibiden have been working together for years, with Ibiden supplying HDI components for multiple generations of Samsung’s Galaxy S series; however, Ibiden’s HDI facility in Beijing has reportedly been acquired by a different company that plans to produce other types of components, meaning its HDI-based partnership with Samsung is over.
The Japanese company will no longer supply HDI boards for the Galaxy S series, and hints that it involves the Galaxy S23 line of products. Samsung has already signed another agreement to get HDI boards from another supplier.
While Ibiden is out of Samsung’s HDI board supply chain due to its acquisition, Samsung will reportedly transfer HDI orders to its other Japanese board supplier, Meiko.
The latter has also been a supplier of printed circuit boards to Samsung, so is not a new addition to Samsung’s supply chain. However, with Ibiden’s exit, Meiko is expected to receive more HDI board orders from Samsung for the Galaxy S23 series.
The Samsung Galaxy S23 series is expected to be released in January or February 2023, and Samsung has already started developing firmware for the upcoming flagship. In addition, the 2023 models will be fully powered by Qualcomm Snapdragon 8 Gen 2 chips. Rumors suggest that the Samsung Galaxy S23 series will benefit from an exclusive SoC model that is highly optimized for the One UI experience.
The Samsung Galaxy S23 series is expected to come with a stronger camera system. Samsung will adjust its supply chain to ensure that the new models are not affected and that the experience is guaranteed.
