The YouTube channel PBKreviews recently disassembled the Samsung Galaxy S23 FE phone and stated that Samsung has equipped the machine with a powerful cooling system, so that the Exynos 2200 chip can perform better.
It was previously reported that the performance of the Exynos 2200 on the Galaxy S23 FE does seem to be better than the Galaxy S22 series. On Geekbench 6.2, the S23 FE has a single-core score of 1612 and a multi-core score of 4005. In the AnTuTu benchmark, the Galaxy S23 FE has a CPU score of 329165 and a GPU score of 437040, while the Galaxy S22 Ultra has a CPU score of 305069 and a GPU score of 312522. Judging from the benchmarks, the CPU performance has improved by nearly 10%, but GPU performance is significantly improved by 30%.
Through disassembly, it was discovered that Samsung has equipped the Galaxy S23 FE with a very large heat sink to dissipate heat more effectively.
The Samsung Galaxy S23 FE is IP68 waterproof and dustproof. After heating the glass back panel, you can see that all openings are sealed with rubber and glue.
The motherboard on the back of the phone is fixed with 20 Phillips screws. After disconnecting the ribbon connector, charging coil and NFC antenna, you can use the pull tab to easily remove the battery. In the end, the anchor gave the phone a repairability score of 8.5.
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