During the Samsung Foundry Forum 2022, the technology manufacturing giant announced its plan to launch the 1.4nm fabrication process in a few years. This production will come two years after the 2nm process has gone into mass circulation in 2025. The company also has more plans in place to serve chips to other industries such as automotive, IoT, and so much more.
To be able to tackle these plans it has and better serves its customers, Samsung will upscale its production by up to three times. With the dependency of more industries on chips, there is a need to put more effort into the production process. Among the steps that Samsung will take to upscale its production are; foundry process technology innovation, process technology optimization for each specific application, stable production capabilities and customized services for customers.
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Achieving its goal to roll out the 2nm process and the 1.4nm process by 2025 and 2027 respectively is not far from the reach of Samsung Foundry. Considering that the industry got the first supply of 3nm chips from Samsung, we can say that they are more than capable of stepping up production to meet the industry’s future needs. Delving deeper into process technology optimization, Samsung will build the 2.5D/3D heterogeneous integration packaging technology for foundry service.
This packaging technology will bring forth a 3D packaging X-Cube with micro-bump interconnection in the year 2024. Following this will be the bump-less X-Cube, which will be available just two years after the micro-bump interconnection. To better achieve this, Samsung Foundry will diversify its workforce in various regions with a focus on different industries.
