Twitter users RGcloudS and OreXda recently exposed the latest news of the Samsung Exynos 2400 SoC, saying the Exynos 2400 will have 10 CPU cores, GPU benchmarks part of the score over the Snapdragon 8 Gen 3.
The final configuration and packaging information for Samsung’s Exynos 2400 SoC is reportedly still up in the air as Samsung weighs its options for the SoC, but the chip is still expected to be unveiled in Samsung’s flagship Galaxy S24 series next year.
The tipster noted that while the Exynos 2400 SoC will have 10 CPU cores, all 10 cores will not be running at the same time, and the chip will schedule the number of cores it needs for each task.
▲ image source tweet by RGcloudS
Additionally, initial rumors claimed that the Exynos 2400 would be produced using Fo-WLP or Fan-out wafer-level packaging, a packaging technique that makes the chip thinner and more energy efficient. However, the tipster said that the chip could use the I-Cube process. Samsung calls this “a heterogeneous integration technology that places one or more logic chips (CPU, GPU, etc.) and several high bandwidth memory (HBM) chips horizontally on a silicon wafer, allowing multiple chips to operate as a single chip in a single package.”
And Twitter user OreXda said that the Exynos 2400 scored more than the Snapdragon 8 Gen 3 on the Vulkan benchmark, and if this data is true, Qualcomm will be challenged head-on from Samsung once again.
▲ image source OreXda tweets
▲ Photo courtesy of a tweet by OreXda
Previous rumors claimed that the Exynos 2400 consists of one high-performance Cortex-X4 CPU core, two high-frequency-running Cortex-A720 performance cores, three low-frequency-running Cortex-A720 performance cores, and four Cortex-A520 efficiency cores.
The official announcement of Samsung, the information of the tipster can only provide a certain reference nature, look forward to Samsung in the second half of this year when the official launch of this processor specifications.
