According to TechPowerUp, Samsung today announced its new “GDDR6W” video memory based on FOWLP technology, which significantly improves bandwidth and capacity.
Samsung officials said that high-performance, high-capacity and high-bandwidth memory solutions are helping to bring the virtual world closer to reality. To meet this growing market demand, Samsung Electronics has developed the industry’s first next-generation graphics DRAM technology — GDDR6W (x64).
Since its release, GDDR6 has seen significant improvements, Samsung said. Last July, Samsung developed a 24 Gbps GDDR6 model. GDDR6W doubles the bandwidth (performance) and capacity while maintaining the same size as GDDR6.
As shown above, the graphics DRAM capacity is increased from 16Gb to 32Gb, and the bandwidth and I/O count is increased from 32 to 64, as twice as many memory chips can be carried in the same size package.
FOWLP technology mounts memory chips directly on silicon wafers instead of PCBs, and in the process, Samsung applies RDL technology to achieve finer wiring patterns. In addition, since there is no PCB involved, the package thickness is reduced and heat dissipation is improved.
The FOWLP-based GDDR6W has a height of 0.7 mm, which is 36% thinner than the previous package with a height of 1.1 mm. Despite the multilayer chip, it still offers the same thermal characteristics and performance as the existing GDDR6. However, unlike GDDR6, the bandwidth of FOWLP-based GDDR6W can be doubled due to the doubling of I/O per package.
In terms of performance, GDDR6W can yield 1.4TB/s of bandwidth at 512 system-level I/Os and a transfer rate of 22Gpbs per pin.
Samsung Electronics completed JEDEC standardization of GDDR6W products in the second quarter of this year, and will also expand the use of GDDR6W to small devices such as notebooks and new high-performance gas pedals for AI and HPC applications through collaboration with GPU partners.
