Qualcomm today in the release of Snapdragon 8 Gen 3 and X Elite processor at the same time, but also for headphones, speakers and mobile computing platforms, launched a new S7 and S7 Pro-Gen 1 audio chip.
With high performance, low power, on-device AI and advanced connectivity, the new audio platform delivers six times the computing power, almost 100 times the AI capability and new ultra-high-end performance with low power consumption of the previous generation platform.
The S7 Pro sound platform is the first to support Qualcomm Extended Personal Area Network technology (XPAN) and Micropower Wi-Fi connectivity, delivering superior audio range over Bluetooth.
The S7 and S7 pro also feature device-side AI for better audio personalization. It also supports up to 192kHz lossless music and enhanced multi-channel spatial audio for gaming, as well as Qualcomm Seamless for better cross-device connectivity. The related explanatory document below:
said Dino Bekis, vice president of Qualcomm:
These platforms set a new benchmark for high-performance sound at ultra-low power. They are equipped with advanced technologies that work in concert with on-device artificial intelligence to deliver an immersive, personalized audio experience wherever you are, whether you're in a meeting, socializing, gaming, listening to music or just need some quiet time.
The S7 Pro platform utilizes our micro-power Wi-Fi and revolutionary Qualcomm® XPAN technology by enabling whole-home and building audio coverage, support for multi-channel lossless music streaming up to 192kHz and enhanced multi-channel spatial audio for gaming.THIS IS A SPONSOR PROMOTION: >>>>>>>>>>>>>
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