The OPPO official then said, “OPPO’s next generation Find X will be the first to be equipped with the Dimensity 9200 flagship core, bringing users the ultimate performance and The next generation of OPPO Find X will be equipped with the Dimensity 9200 flagship core, bringing users a new flagship experience with extreme performance and energy efficiency. Please look forward to it!”
OPPO’s next generation Find X flagship is expected to be the Find X 6 series. The news broke that the new OPPO Find X6 series will have three 50-megapixel lenses on the rear, including a Sony IMX989 sensor for the main camera with a one-inch mega bottom, a 172% increase in light-sensitive area and 76% increase in light-sensitive capability, as well as a 32.5% increase in photo speed and 11% increase in startup speed, and support for chip-level 4K HDR night video shooting. At the same time, the machine will also be equipped with self-developed chip Marianas MariSilicon X chip.
MediaTek’s Dimensity 9200 chip uses TSMC’s second-generation 4nm process processor, which integrates 17 billion transistors. Equipped with 3.05GHz Cortex-X3 super core, three 2.85GHz A715 large cores, four 1.8GHz A510 small cores, super cores and large cores all support pure 64-bit applications. There is also 8MB of tertiary cache and 6MB of system cache, and the GPU is Immortalis-G715 MC11.
Official tests say that the Dimensity 9200 offers 12% better single-core performance, 10% better multi-core performance, 10% better cooling capability and up to 25% lower power consumption than the Dimensity 9000’s GeekBench 5 CPU.
The 9200 is the first to feature the Immortalis-G715 flagship GPU, which supports mobile hardware ray tracing technology, and GFXBench Manhattan 3.0 test performance is 32% higher and power consumption is 41% lower than the 9000. Variable Rate Rendering (VRS) support improves frame rates by 10% and reduces power consumption by 21%.
The MediaTek Dimensity 9200 also supports LPDDR5X 8533Mbps memory with 13% higher bandwidth than the Dimensity 9000 and also supports 8-channel UFS 4.0 flash memory with multi-loop queuing technology for significantly faster data transfers.
The 9200 integrates TSMC’s 6nm wireless connectivity chip and introduces “5G New Dual-Pass” based on dual SIM mode, the first to support the upcoming Wi-Fi 7 wireless connectivity as well as Bluetooth 5.3 and Bluetooth Audio LE Audio, covering global satellite signals.
The 9200 is equipped with Imagiq 890 image processor, which is the first to support RGBW sensor, and the intelligent image semantic segmentation technology combined with APU 690, supporting AI dual-track capture, AI movie mode, etc. Equipped with MediaTek MiraVision 890 mobile display technology, supporting full-scene HDR display, including AI regional image quality enhancement, multi-block layered color management, and adaptive refresh rate (35% lower power consumption).
Vivo has announced the world premiere of the MediaTek Dimensity 9200 flagship processor, coming soon. The new phone is expected to arrive in November.
