Nikon announced the launch of a new generation of i-line stepper lithography machine “NSR-2205iL1” with a 5x reduced projection magnification, which is expected to be launched in the summer of 2024.
The lithography machine is said to have a reduced-projection amplification system that supports a wide range of products such as power semiconductors, communication semiconductors and MEMS, and to be highly compatible with Nikon’s existing i-line exposure equipment; the NSR-2205iL1 represents the most significant update to Nikon’s 5-fold stepping technology in the last twenty-five years and will respond directly to customer demand for these lithography systems, which play a vital role in chip manufacturing. systems that play an important role in chip manufacturing.
Nikon says the NSR-2205iL1 offers excellent economics compared to existing Nikon i-line exposure systems, optimizing the production of a wide range of semiconductor devices regardless of wafer material.
This is the first time in Nikon’s 25-year history (counting from 1999, when the NSR-2205i14E2 began taking orders) that Nikon has introduced a new i-line exposure system with a 5x lower projection magnification.
According to Nikon, the demand for semiconductors to support electric vehicles, high-speed communications and Equipment is growing exponentially as these applications become more commonplace. These semiconductors must perform a variety of challenging functions, so equipment manufacturers need specialized substrates and exposure systems to manufacture these chips.
In addition to expanding a variety of functional options to meet the diverse needs of customers, this newly developed i-line lithography machine will support long-term equipment production.
The NSR-2205iL1 is said to provide high productivity and optimize yield levels for a variety of semiconductor manufacturing processes based on high-precision wafer measurement through a variety of advantages such as multipoint autofocus (AF), advanced wafer table levelling technology, and a wide depth of focus range (DOF). In addition, with its wafer thickness and size compatibility, high wafer warpage tolerance, and flexible features including, but not limited to, support for SiC (Silicon Carbide) and GaN (Gallium Nitride) processing, the NSR-2205iL1 i-line lithography is well suited for a wide range of application scenarios. This lithography machine will provide an excellent price/performance ratio while meeting the diverse needs of chipmakers.
