Nikkei Asian Review reported that major display manufacturers in China and Taiwan are entering the chip packaging business to protect themselves from the slowdown in demand for consumer electronics after the epidemic.
A number of people familiar with the matter revealed that China Taiwan’s Guntron, AUO, as well as the mainland panel leader BOE, Huaxing Optoelectronics have set up a team responsible for adjusting the panel production technology to be used for chip packaging and assembly. Compared with the manufacture of chips, chip packaging requires lower technology.
The sources said that the panel industry’s main material suppliers, including Corning and Japan’s glass substrate maker Asahi Glass also bet resources to develop advanced chip packaging glass carriers (glass carriers).
Since then, BOE-related investment funds have also invested in many semiconductor-related companies, including chip production materials, equipment and manufacturing fields.
And Sunac will also start developing panel-level packaging in 2019, while the company also intends to transform its old 3.5-generation panel production line into a panel-level chip packaging line. Meanwhile, sources close to the matter said that AUO is testing the process of panel-level packaging, while Huaxing Optoelectronics has already purchased additional equipment to study the feasibility of the chip packaging business.