According to the record of investor relations activities disclosed by Lanqi Technology today, Lanqi Technology said during the institutional research, with the steady increase in the penetration of DDR5-related products, the company’s memory interface chip and memory module supporting chip revenue in the third quarter of 2022 have increased, thus driving the growth of interconnect class chip product line business.
According to the report, the demand for memory interface and module-supporting chips is positively correlated with the number of server memory modules. The industry’s demand for memory capacity is continuously increasing, and in order to meet the growing demand for memory capacity, it is mainly achieved in two ways, one is to increase the density of memory particles and the other is to increase the number of memory modules. If the increase in memory particle density slows down in a certain period, the demand for memory capacity growth will rely more on increasing the number of memory modules to achieve, which will drive the growth in demand for memory interfaces and module-supporting chips. At the same time, with the server industry’s boom, customers will increase system performance by increasing the number/capacity of memory modules in stock servers. In addition, according to industry standards, the demand for DDR5 generation memory module chipsets will increase significantly.
Lantech expects to further improve the DDR5 ecosystem and increase the penetration of DDR5 memory modules as DDR5-enabled CPUs are gradually introduced. The company has already mass-produced DDR5 memory interface chips and memory module-supporting chips, and the increase in DDR5 memory module penetration will drive the company’s DDR5-related chip sales to continue to grow.
In addition, the company’s AI chip adopts near-memory computing architecture, which is mainly used to solve the problem of CPU bandwidth, performance bottleneck and GPU memory capacity bottleneck of AI computing in reasoning application scenarios under large data throughput, providing customers with low-latency and high-efficiency AI computing solutions, which is equivalent to a dedicated gas pedal for CPU. Currently, the company’s AI chip is well-developed. This year, the company will continue to promote AI chip software and hardware synergy and performance optimization, while actively promoting the first generation AI chip engineering prototype before the flow of chip preparation, is expected to complete the first generation AI chip engineering prototype flow of chip by the end of 2022.
