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According to the technology patent announced by the World Intellectual Property Organization (WIPO) in May this year, Microsoft plans to modularize the HoloLens headset to further reduce the cost of the headset, suggesting that it will enter the consumer market.
The HoloLens solution launched by Microsoft is currently mainly for enterprises and has developed IVAS (military version of HoloLens) for the US Army, and has not opened purchase channels to ordinary users.
The patented design sketches as follows. It can be seen that most of the components of the headset can be disassembled. Microsoft hopes to further reduce costs through modular design.
Including headbands, VR headsets, glasses temples, modular sensors and display modules can be connected through standard interfaces.
In addition, the wearer can also use the universal interface to connect computing modules, additional power supplies and other modular units.
