Most Viewed Content:

Toyota responds to continued production cuts in the next 3 months: easing pressure on dealer earnings

In response to the news that "production will continue...

Google to bring PWA application backup & restore function for Chrome/android

According to thespAndroid reports, GitHub's Chromium repository recently added...

Microsoft working on new features for Win11 / Win12: smart notifications, depth-of-field effects

According to the source Albacore (@thebookisclosed), Microsoft is preparing...

Micron unveils its first UFS 4.0 module, enabling smartphone speeds of 4300MB/s

On Wednesday, Micron announced the launch of its first memory chip that complies with the UFS 4.0 specification. According to the report, smartphones equipped with this module are expected to be the fastest devices to date.

Micron expects some of its flagship smartphones, tablets and ultra-low-power laptops to use its UFS 4.0 module this year. In addition to offering higher performance than its predecessor, the new generation also achieves a 25 percent improvement in power efficiency.

According to the report, Micron UFS 4.0 is available in three capacities – 256GB, 512GB and 1TB, with Micron’s own master control.

Among them, the high-end 512 GB and 1 TB products use 232 layers of 1Tb 3D TLC NAND six-sided (Note: Here the face refers to the number of planes in the NAND die, which is also the first six-plane architecture NAND) particles, can provide 4300 MB/s sequential read speed and 4000 MB/s sequential write speed, which is also the highest performance so far UFS memory module for smartphones.

Based on data provided by Micron, the 256 GB chip is slightly slower than the 512 GB and 1 TB models because it uses quad-planar 3D NAND particles.

Micron’s UFS 4.0 memory module uses two M-PHY Gear 5 channels for data transfer and supports proprietary firmware features such as Data Stream Separation, Auto Read Burst and Eye Monitoring.

Micron’s latest mobile solution tightly combines our industry-leading UFS 4.0 technology, proprietary low-power controller, 232-layer NAND and highly configurable firmware architecture to deliver unparalleled performance,” said Mark Monteil, vice president and general manager of Micron’s Mobile Business Unit.”

Benefit from high-capacity, 232-layer 3D TLC NAND particles. Micron UFS 4.0 modules are extremely thin. The company says its z-height is no more than 0.8-0.9mm, which will allow handset makers to make their products thinner or accommodate higher-capacity batteries.

Officials said Micron is currently supplying its UFS 4.0 samples to major smartphone manufacturers and expects these products to begin mass production and use in a variety of end models in the second half of this year.

Latest

Mercedes-Benz to Unveil New E-Class Standard-Axis Sports Version at Beijing Auto Show

Recently, we learned from Mercedes-Benz officials that the new...

Changan Mazda releases fourth preview image of new model

Changan Mazda released the fourth preview image of its...

Huawei Pura 70 Ultra satellite messaging supports sending pictures

Bruce Lee, CTO of Huawei Terminal BG, demonstrated the...

Google Pixel 9 Pro real phone images exposed: Tensor G4 chip, 16GB memory

The source rozetked recently published a blog post and...

Newsletter

Don't miss

Mercedes-Benz to Unveil New E-Class Standard-Axis Sports Version at Beijing Auto Show

Recently, we learned from Mercedes-Benz officials that the new...

Changan Mazda releases fourth preview image of new model

Changan Mazda released the fourth preview image of its...

Huawei Pura 70 Ultra satellite messaging supports sending pictures

Bruce Lee, CTO of Huawei Terminal BG, demonstrated the...

Google Pixel 9 Pro real phone images exposed: Tensor G4 chip, 16GB memory

The source rozetked recently published a blog post and...

Google Pixel 8a high-definition renderings exposed again

Android Headline published a blog post today, sharing more...
Threza Gabriel
Threza Gabrielhttps://www.techgoing.com
Threza Gabriel is a news writer at TechGoing. TechGoing is a global tech media to brings you the latest technology stories, including smartphones, electric vehicles, smart home devices, gaming, wearable gadgets, and all tech trending.

Alfa Romeo Milano to be renamed Junior

Recently, according to overseas reports, Alfa Romeo Milano will be renamed Junior due to strong protests from Italian politicians. The car is named after...

Future iCAR: Three Sequences and Product Plans Exposed

Recently, the much-anticipated Chery iCAR V23 officially debuted. The new car was jointly built by Chery and Zhimi Technology and is positioned as a...

Tesla layoffs: Some employees arrived at the factory to find out they were fired

According to BusinessInsider, multiple Tesla factory workers revealed that they only learned that they were fired after security personnel scanned their badges and were...