On Wednesday, Micron announced the launch of its first memory chip that complies with the UFS 4.0 specification. According to the report, smartphones equipped with this module are expected to be the fastest devices to date.
Micron expects some of its flagship smartphones, tablets and ultra-low-power laptops to use its UFS 4.0 module this year. In addition to offering higher performance than its predecessor, the new generation also achieves a 25 percent improvement in power efficiency.
According to the report, Micron UFS 4.0 is available in three capacities – 256GB, 512GB and 1TB, with Micron’s own master control.
Among them, the high-end 512 GB and 1 TB products use 232 layers of 1Tb 3D TLC NAND six-sided (Note: Here the face refers to the number of planes in the NAND die, which is also the first six-plane architecture NAND) particles, can provide 4300 MB/s sequential read speed and 4000 MB/s sequential write speed, which is also the highest performance so far UFS memory module for smartphones.
Based on data provided by Micron, the 256 GB chip is slightly slower than the 512 GB and 1 TB models because it uses quad-planar 3D NAND particles.
Micron’s UFS 4.0 memory module uses two M-PHY Gear 5 channels for data transfer and supports proprietary firmware features such as Data Stream Separation, Auto Read Burst and Eye Monitoring.
Micron’s latest mobile solution tightly combines our industry-leading UFS 4.0 technology, proprietary low-power controller, 232-layer NAND and highly configurable firmware architecture to deliver unparalleled performance,” said Mark Monteil, vice president and general manager of Micron’s Mobile Business Unit.”
Benefit from high-capacity, 232-layer 3D TLC NAND particles. Micron UFS 4.0 modules are extremely thin. The company says its z-height is no more than 0.8-0.9mm, which will allow handset makers to make their products thinner or accommodate higher-capacity batteries.
Officials said Micron is currently supplying its UFS 4.0 samples to major smartphone manufacturers and expects these products to begin mass production and use in a variety of end models in the second half of this year.
