Due to Qualcomm previously released by Samsung OEM Snapdragon 888 and Snapdragon 8 Gen 1 chip heat problems more serious, many manufacturers have launched dual versions of the flagship phone, such as Vivo released on April 25 this year Vivo X80 Pro flagship phone is equipped with Snapdragon 8 Gen 1 chip and MediaTek Dimensity 9000 chip two options. Today, a blogger has revealed some of the information about the MediaTek Dimensity 9000 iteration of the chip.
According to digital blogger @DigitalGossip, the first end product with the Dimensity 9000 iteration will be released at the end of the year, with the iteration shipping much earlier than the Dimensity 9000. Considering that many Snapdragon 8 Gen 2 models will also be released by the end of the year, this is a “flagship core showdown between Qualcomm and MediaTek at the shipping gate”.
The blogger said on September 15 that next year’s Snapdragon 8 Gen 2 could come in a “factory-ashed” UHF version, with a GPU that scales up from this year’s version. The blogger also said that because the Qualcomm Snapdragon 8 Gen2 chip itself uses TSMC’s 4nm process, next year’s flagship chip will not be as big as this year’s half-year update and that the Snapdragon 8+ Gen 2 chip will simply be the overclocked version of the Snapdragon 8 Gen 2 chip in the second half of next year.
The breaking information shows that the first Snapdragon 8 Gen2-equipped phones are scheduled to be released after Qualcomm’s Snapdragon Summit, which is tentatively scheduled for the second half of November, with the first manufacturers making normal progress. The Xiaomi 13 series, Redmi K60 series and Vivo X90 series will all be equipped with Snapdragon 8 Gen 2 processors.
