MediaTek today announced the launch of the Dimensity 7200-Ultra mobile chip, which uses TSMC’s second-generation 4nm process. The eight-core CPU architecture includes 2 Arm Cortex-A715 cores clocked at 2.8GHz and 6 Cortex-A510 cores.
In addition, the chip integrates Arm Mali-G610 GPU and AI processor APU 650 and is equipped with a 14-bit HDR-ISP image processor Imagiq 765 customized for 200 million pixels, supporting up to 200Mp main camera and 4K HDR video recording.
Dimensity 7200-Ultra is also equipped with a MediaTek HyperEngine 5.0 game engine, which supports AI-VRS variable rendering, intelligent control, etc. It also supports 5G dual carrier aggregation, 5G dual card dual standby and dual card VoNR and other functions.
MediaTek said that terminals equipped with Dimensity 7200-Ultra mobile chips will be available to everyone in the near future.
MediaTek’s official website has not yet listed the specific parameters of Dimensity 7200-Ultra. Judging from the current information, the chip parameters are no different from those of Dimensity 7200. It is expected to be designed in conjunction with a certain phone manufacturer. Special edition.
It is worth mentioning that Xiaomi has previously launched the Dimensity 8200-Ultra chip with MediaTek. Judging from the current news from @digitalchat.com, Xiaomi is about to launch the Redmi Note 13 series of phones. All three versions have registered 200-megapixel lenses, which is basically consistent with MediaTek’s promotional highlights.
According to @digitalchatstation, the two low-profile versions of the Redmi Note 13 series are 67W+5120mAh±, and the high-profile version is 120W+5000mAh±. All three versions have registered eye protection 1.5K+200Mp 1/1.4″ HPX.
