After the first CPU benchmark of the MediaTek Dimensity 9200 processor was released, the first GPU benchmark also came.
Blogger @i Ice Universe released the first GPU benchmark of Dimensity 9200, equipped with Immortalis-G715 GPU, GFX 1080p Manhattan 3.0 off-screen test score of 328 Fps, GFX 1080p Manhattan 3.1 off-screen test score of 228 Fps.
The blogger @Digital Chat Station said that the detection frequency of the Dimensity 9200 prototype is 3.05GHz + 2.85GHz + 2.0GHz.
In contrast, according to Qualcomm’s official data, the Snapdragon 8+ Gen 1’s GFX 1080p Manhattan 3.0 off-screen test score is 281 Fps, and the GFX 1080p Manhattan 3.1 off-screen test score is 188 Fps, and MediaTek Dimensity 9200 has a significant lead. .
The two results of MediaTek Dimensity 9000+ are about 220 Fps and 160 Fps respectively, and the two results of Apple A16 are about 200 Fps and 280 Fps respectively. It seems that the GPU performance of MediaTek Dimensity 9200 is really bright, maybe only The Qualcomm Snapdragon 8 Gen 2, which will be released at the end of the year, can try to compete.
Blogger @Digital Chat Station previously broke the news that the extreme performance of Qualcomm Snapdragon 8 Gen 2 GPU has surpassed Apple’s A16 chip, and the performance of MediaTek Dimensity 9200 has also been greatly improved, and the architecture is more aggressive than Qualcomm.
The blogger @Digital Chat Station released the first running score of the Dimensity 9200 processor. The running score uses the AnTuTu platform, and the actual measurement at room temperature is 1.26 million +.
According to previous reports, Qualcomm will release the annual flagship chip Snapdragon 8 Gen2 a month in advance in November, and the first flagship chips will also be released in November, about a month earlier than in previous years. In terms of MediaTek, the release of the Dimensity 9200 platform will be earlier than the Snapdragon 8 Gen2, and the first model will be released at the end of November.
According to previous reports, the Dimensity 9200 will use the latest TSMC 4nm process, and the CPU architecture will be upgraded to a new generation of ultra-large core Cortex-X3. The X3 core is expected to increase performance by 25%, and also greatly improve the energy efficiency ratio. The GPU will use the latest Immortalis-G715. The biggest feature is that it supports hardware-level ray tracing technology. Compared with software-accelerated ray tracing, the performance can be improved by 300%. At the same time, compared with the previous generation Mail-G710, the overall performance is also improved by 15%, and the energy consumption is reduced by 15%.
