Marvell Technology has created a high-speed, high bandwidth inter-chip interface module using TSMC’s 3nm process.
The module was manufactured using a number of technologies including 112G XSR SerDes (Serializer / Deserializer), Long Reach SerDes, PCIe Gen 6 / CXL 3.0 SerDes and 240 Tbps Parallel Interconnect.
The blue line on the left shows the high-performance PCIe Gen 6 / CXL 3.0 optimized 3nm SerDes signal, while the orange line on the right shows the 112G XSR optimized low latency 3nm SerDes signal.
Parallel inter-chip connections can reach speeds of 240 Tbps, 45% faster than available alternatives for multi-chip applications. Although the transmission distance is only a few millimetres or less, 10,000 HD movies can be downloaded per second.