Intel is one of the world’s leading IDM-type semiconductor companies, the chip design their own production, do not need to outsource capacity, and AMD now relies on TSMC foundry different, but in the next 14 generations of Core processors will be different, Intel will also use TSMC 5nm, 6nm process, high demand for capacity.
Intel recently announced the architecture details of the 14th generation Core at the hotchips conference. CPU Tile module is produced by Intel 4 process, which is Intel’s first EUV process, IOE Tile and SoC Tile are produced by TSMC’s 6nm process, and Graphics Tile, which is the previously mentioned GPU module, is based on TSMC’s 5nm process.
There is also an intermediary layer, which is produced using Intel’s 22nm process.
Thus, it seems that without considering the intermediary layer, three of the four core units of the 14th generation Core are produced by TSMC, and the part produced by Intel itself only accounts for 1/4.
Such cooperation is beneficial to Intel and TSMC, Intel can quickly expand production capacity, but also reduce costs, TSMC is gaining important orders, 5nm and 6nm production capacity is not worried about excess.
However, for AMD, Intel joined the ranks of the 5nm capacity is not necessarily a good thing, Intel still holds 3/4 of the world’s x86 share, the annual sales are still much higher than AMD, TSMC will inevitably tilt to Intel’s capacity.
