The invention patent for “semiconductor packaging” applied by Huawei Technologies Co., Ltd. was announced.
Attached is a patent summary:
A semiconductor package (100) comprising: a substrate (110); a semiconductor chip (111) having a top surface (103a) and a bottom (103b) opposite to the top surface, wherein the bottom surface (103b) of the semiconductor chip (111) is placed on the substrate (110), wherein the semiconductor chip (111) includes at least one first terminal pad (102a, 102b) arranged on the top surface (103a) of the semiconductor chip (111) for electrically connecting the semiconductor chip (111) ); at least one all-metal body (113a, 113b) is placed on at least one first terminal pad (102a, 102b) of the semiconductor chip (111), wherein at least one all-metal body (113a, 113b) has electrical connections to at least a spherical portion (111a, 111b) of a first terminal pad (102a, 102b); and a mold body enclosing a semiconductor chip (111) and a spherical portion (111a, 111b) of at least one full metal body (113a, 113b) (115).
This patent provides an alternative mold embedding solution that achieves cost reduction and provides efficient and reliable manufacturing of semiconductor packages.
