Recently, a notice circulating on the Internet said that Huawei announced that it has successfully developed a chip stacking technology solution. In addition, there are rumors that Huawei’s chip stacking solution, which can achieve 7nm level under 14nm process, belongs to the curve to save the country.
According to Sina Technology, for the notification, Huawei responded that the notification was a counterfeit and a rumor.
In May last year, Huawei Technologies Co., Ltd. disclosed the patent of “chip stacking packaging structure and its packaging method, electronic equipment”. The problem of reliable bonding of chip stacking units on the same main chip stacking unit.