Honor’s new folding screen phone and a large version of the Magic UI system will also be released at the end of this year. Now the configuration of the new Honor mobile phone has been further updated.
According to the Weibo blogger @王子百ishitong, both the Honor Magic V2 folding screen and the Magic 5 / Pro series are equipped with the Snapdragon 8 Gen 2 chip, of which the Magic V2 folding screen will be released first, and it is expected to meet you before the end of this year.
According to the Qualcomm Snapdragon Summit schedule, the Snapdragon 8 Gen 2 chip is expected to be released in November this year and will use TSMC’s 4nm process.
It was previously reported that the Honor Magic V2 folding screen and Magic UI 7.0 will be released in December this year. Honor CEO Zhao Ming previously revealed that Honor will bring more cross-device interconnection and full-scene functions in the next Magic UI 7.
The new foldable screen phone that Honor will release next will use a large battery design. The new phone will use a dual-cell charging solution. The capacities of the two batteries are 2030mAh and 2870mAh respectively, and the typical value will reach 5000mAh, which will be the largest among the folding screen phones this year.
