According to foreign media reports, as the major manufacturers have built production lines or increased capacity, the global 12-inch fab capacity, in 2026 will hit a new high, the monthly capacity is expected to reach 9.6 million wafers.
Global 12-inch fab capacity reaches 9.6 million wafers in 2026, according to the International Semiconductor Industry Association.
Ajit Manocha, president and CEO of the International Semiconductor Industry Association, said that although the pace of global 12-inch fab capacity expansion is slowing, the industry remains focused on increasing capacity to meet the strong long-term demand for semiconductors.
The International Semiconductor Industry Association disclosed that in 2022-2026, including Grosvenor, Infineon, Intel, Armor Man, Micron, Samsung Electronics, SK Hynix, SMIC, Texas Instruments, TSMC and other chipmakers, are expected to increase 12-inch fab capacity, these companies plan 82 new factories or production lines, will be put into operation between 2023 and 2026 operation.
From the data of the International Semiconductor Industry Association, focusing on investment in mature processes, domestic 12-inch fab capacity, in the global will occupy about a quarter of the proportion of monthly capacity is expected to reach 2.4 million wafers, the proportion of global capacity is expected to increase from 22% last year, to 25% in 2026.
Due to weak demand for memory chips, South Korean manufacturers 12-inch fab capacity, the proportion of global production capacity is expected to decline from 25% last year to 23% in 2026.
In the automotive field and large-scale investment in chips, driven by the Americas, Europe and the Middle East, the share of capacity is expected to increase, last year only 0.2% share of the Americas market, in 2026 is expected to increase to nearly 9%; Europe and the Middle East share is expected to increase from 6% to 7%. Southeast Asia’s 12-inch fab capacity share is expected to remain unchanged at 4% from 2022 to 2026.
