Semiconductor device supplier GigaDevice announced the launch of the SPI NOR Flash GD25LE128EXH in a 3mm×3mm×0.4mm FO-USON8 package, with a maximum thickness of only 0.4mm and a capacity of 128Mb. At present, the mainstream package of 128Mb capacity products in the industry is 6mm×5mm×0.8mm WSON8, and GD25LE128EXH is the smallest plastic package product that can be realized in this capacity in the industry.
It is learned from the official sources that the GD25LE series SPI NOR Flash is the flagship low-power product of GigaDevice. The GD25LE128EXH launched this time continues the performance of the LE series, with a maximum clock frequency of 133MHz and a data throughput of 532Mbit/s. It improves system access speed and boot efficiency; at 4-channel 133MHz, the read power consumption is only 6mA, which is 45% lower than similar products.
According to the official introduction, GD25LE128EXH is pin-compatible with the 3mm×4mm×0.6mm USON8 package products with a capacity of 64Mb or below, and there is no need to adjust the PCB layout. The same series of 3mm×2mm×0.4mm FO-USON8 package products GD25LE64E will provide samples at the end of May.
