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Fujitsu looks forward to next-generation data center processor Monaka

Fujitsu is developing Monaka, a next-generation processor for artificial intelligence, high-performance computing (HPC) and data center applications, currently in fiscal year 2027 (Note: 2026 Available from April 1 to March 31, 2027).

One of the first 2nm data center CPUs, Monaka will use about 150 enhanced Armv9 cores and support accelerators, have the SVE2 instruction set, the vector length can vary from 128bit to 2048bit, and be equipped with SRAM chips and I/O chips. It will support DDR5 memory, PCIe 6.0 connectivity, and CXL 3.0 interconnect.

It is worth mentioning that the successor to Riken’s supercomputer “Fugaku” is planned to be launched around 2030. As such, Monaka is primarily competing for the emerging data center market rather than solving supercomputer performance problems.


Image source Pexels

Fujitsu introduced its next-generation data center processor, MONAKA, to media and analysts at a research strategy briefing at its Kawasaki plant on Wednesday.

The company plans to launch the processor in fiscal 2027, which will use Arm architecture and TSMC’s 2nm process and will achieve twice the energy efficiency of competitors.

Naoki Shinjo, general manager of Fujitsu’s advanced technology development department, said: “The amount of data processed globally in 2030 is expected to reach 10 times that of 2020, and is expected to continue to grow explosively thereafter.” He believes that data will “increase as the amount of data increases. , the demand for large data centers will also increase, but unless we reduce energy consumption, it will be difficult to achieve carbon neutrality.”

FUJITSU-MONAKA aims to significantly improve the energy efficiency of data centers and pursue high-speed data processing required for AI and DX.

According to reports, the processor is based on Fujitsu’s unique technologies, such as the micro-architecture and low-voltage technology cultivated by supercomputers K and Fugaku. It also uses Arm’s latest architecture “Armv9-A” and TSMC’s 2nm process, and will also use 3D Chiplet packaging technology. wait.

Fujitsu said that the number of processor cores they are currently developing is about 150, supports SVE2 SIMD, supports DDR5 memory, the external interface supports PCI Express 6.0 (CXL 3.0), and the cooling system supports air cooling.

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Threza Gabriel
Threza Gabrielhttps://www.techgoing.com
Threza Gabriel is a news writer at TechGoing. TechGoing is a global tech media to brings you the latest technology stories, including smartphones, electric vehicles, smart home devices, gaming, wearable gadgets, and all tech trending.

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