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Fibocom’s 5G module FG370 has achieved mass production: based on the MediaTek T830 chip platform

IoT wireless communication solutions and wireless communication module provider, Guanghe Tong officially announced that the new generation of 5G module FG370 has achieved mass production, and officially released FWA (the full name Fixed Wireless Access) solutions based on FG370 during MWC 2023, including CPE and MiFi reference design solutions. At MWC, FG370 module products, CPE and MiFi reference design demos were unveiled.

The FG370-based FWA solution, including CPE and MiFi reference design demos, fully supports WiFi 7 features, the BE19000 CPE reference design demo measures 10014716.75mm and supports tri-band Wi-Fi 7, expandable to 12.5G/11G PHY and SLIC interface. The BE6500 MiFi reference design demo measures 128.964.15.85mm and supports dual-band Wi-Fi 7, is expandable to 1*1G PHY interface, and provides software algorithms such as fast charging management.

To meet different customers’ needs for 5G rate, 5G coverage and storage, GWT continues product optimization in PC1.5, low-band 4×4 MIMO, and separate storage, as well as product upgrades in the millimeter wave band.

The FG370 module was released in October 2022 and has already obtained CE and GCF certifications.

Thanks to the MediaTek T830 platform performance, FG370 has significantly upgraded the main frequency performance and gigabit throughput performance. Without increasing CPU load, the FG370 delivers gigabit throughput performance for 5G network transmissions to Ethernet or Wi-Fi.

In terms of 5G speed and signal coverage, the FG370 supports up to 300MHz bandwidth in both FDD and TDD hybrid modes and NR 4CA (Quad Carrier Aggregation) for downlink, jumping to a maximum downlink speed of 7.01Gbps. In addition, the FG370 supports PC1.5 with a transmit power of up to 29dBm, which greatly improves 5G uplink speed and 5G effective coverage.

The FG370 has a wide range of peripheral interfaces (including 3 PCI-Express, USB 3.2, and two USXGMII interfaces at up to 10GbE) and can be extended to SLIC functionality via PCM / SPI interfaces to support RJ11 phone interfaces.

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Threza Gabriel
Threza Gabrielhttps://www.techgoing.com
Threza Gabriel is a news writer at TechGoing. TechGoing is a global tech media to brings you the latest technology stories, including smartphones, electric vehicles, smart home devices, gaming, wearable gadgets, and all tech trending.

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