In the cutting-edge semiconductor fields such as logic, memory, and CMOS sensors, the manufacturing process is becoming more and more complicated. There are more and more alignment measurement points to be measured before.
If alignment measurement is performed on a large number of measurement points in a semiconductor lithography machine, the measurement itself will be very time-consuming, thereby reducing the production efficiency of the semiconductor lithography machine. To this end, the semiconductor manufacturing field has introduced a wafer measuring machine to separate the alignment measurement function of the semiconductor lithography machine, so as to ensure the high precision and efficiency of production.
On February 21, Canon launched the “MS-001”, a wafer measuring machine for semiconductor manufacturing, that enables high-precision alignment measurement of wafers.
▲ MS-001
According to reports, the alignment oscilloscope equipped with “MS-001” is equipped with an area sensor, which can perform the multi-pixel measurements and reduce noise during measurement. In addition, “MS-001” can also measure various types of alignment marks.
By employing a newly developed oscilloscope light source for alignment, the new product offers a wavelength range 1.5 times larger than that measured in semiconductor lithography equipment, enabling alignment measurement at any wavelength desired by the user. Therefore, “MS-001” can achieve higher alignment measurement accuracy than measurements performed in semiconductor lithography equipment.
▲ Added alignment marks (schematic)
Canon said that with the application of new products, most of the alignment measurement can be completed before the wafer is transported to the semiconductor lithography equipment, reducing the workload of alignment measurement operations in the semiconductor lithography equipment, thereby improving semiconductor lithography equipment productivity.
