ASUS and Intel have teamed up to launch a new chip package for laptops, called Supernova SoM (Supernova SoM), which combines the latest Intel CPU with LPDDR5X memory in the same package. At CES, Asus showed off the technology.
According to reports, the Supernova SoM design combines Intel’s 13th generation CPU chip and LPDDR5X memory to form a complete package, reducing the PCB area from the original 5060mm package to the current 4244.7mm package. With the support of this packaging technology, the CPU, memory particles, and communication modules are highly integrated, which can reduce the core area of the motherboard by 38%, and can also improve the overall cooling efficiency of the system. In addition, Supernova SoM shortens the distance between CPU and memory compared to traditional packaging technology, allowing higher-frequency memory to be run.
ASUS’ latest Zenbook X Ultra notebook uses this “Supernova SoM” packaging technology.
