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Kodi 20 Nexus Launched with AV1 Hardware Decoding and PipeWire Multimedia Server

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OnePlus debuts its first Pad: 11.6-inch large screen and all-metal body

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Apple, AMD and Nvidia compete for TSMC’s AI chip orders, related chips will be produced after April

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ASUS and Intel bring Supernova SoM chip package: CPU and LPDDR5X memory in one package

ASUS and Intel have teamed up to introduce a new chip package for laptops called Supernova SoM, which combines the latest Intel CPUs with LPDDR5X memory in the same package.

According to the introduction, Supernova SoM design combines Intel’s 13th generation CPU chips and LPDDR5X memory into a complete package, reducing the PCB area from the original 5060mm package to the current 4244.7mm package.

According to ASUS, this “Supernova SoM” packaging technology allows for a high degree of integration of CPU, memory particles and communication modules, reducing the core area of the motherboard by 38% and also improving the overall thermal efficiency of the system. The extra space can accommodate the more powerful RTX4080 graphics, providing users with greater stability, higher GPU performance, and thus higher TDP wattage. Compared to traditional packaging technology, the Supernova SoM shortens the distance between the CPU and memory, allowing for higher-frequency memory to be run.

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Chipmakers under more pressure as helium prices rise

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Li Auto: Aim to become the world’s leading artificial intelligence company by 2030

Li Xiang, CEO of Li Auto, issued a letter to all employees today, which mentioned that it will become the leader of the global...