According to blogger @手机 Chip达人, Apple will use a new material to manufacture thinner printed circuit boards starting next year.
It is reported that Apple will use resin-coated copper foil (RCC) as the new printed circuit board (PCB) material in 2024. This change will allow Apple to manufacture thinner PCBs. The current iPhone PCB is made of a Made of flexible copper-based material. Thinner PCBs can free up valuable space inside compact devices like iPhones and Apple Watches, providing more space for larger batteries or other components.
It was previously reported that the screen sizes of the iPhone 16 Pro and Pro Max models are expected to increase from 6.1 inches and 6.7 inches to 6.3 inches and 6.9 inches respectively. Part of the increase in size may be due to the need for more internal space to accommodate additional components, such as a quad-prism telephoto camera with 5x optical zoom and a capacitive Action button.
@手机 Chip达人 was the first to break the news that the iPhone 14 will use the A15 bionic chip, and the A16 will be exclusive to the iPhone 14 Pro model. It is noted that the blogger also recently said that the A17 chip designed for iPhone 16 and iPhone 16 Plus will use a completely different manufacturing process from the A17 Pro in iPhone 15 Pro to reduce costs.
