Both NVIDIA and AMD will release a new generation of GPUs this year. The former has attracted everyone’s attention as the “NVIDIA GTC Conference” is approaching, as well as many revelations and even physical pictures of GeForce RTX 40 series graphics cards, although the latter’s Radeon RX 7000 series graphics cards have attracted everyone’s attention. It will be later, but it doesn’t seem to exist, and there is not much news in the near future.
AMD gaming marketing director Sasa Marinkovic recently tweeted on his social media account that “bigger doesn’t necessarily mean better.” Although the content did not mention specific products, it is presumed that it should be related to the Ryzen 7000 series desktop. The processor has nothing to do with the Radeon RX 7000 series GPU based on the RDNA 3 architecture.
Some analysts pointed out that Sasa Marinkovic’s remarks may point to a large number of recent leaks involving the GeForce RTX 4090 graphics card. The so-called larger may point to the graphics card having a larger-scale cooling system, resulting in an oversized four-slot thickness. volume. AMD’s cooling solution seems to be more friendly. It is rumored that the new graphics card is a 2.5-slot thickness, still a three-fan configuration, and only equipped with two 8Pin external power supply interfaces.
Sam Naffziger, AMD senior vice president, corporate researcher and product technology architect, said in an interview with the media that the total power consumption of the next-generation GPU will increase. However, combined with Sasa Marinkovic’s statement, it seems that the efficiency may be higher than the competition. According to AMD’s official statement in the past, the performance per watt of the RDNA 3 architecture will increase by 50%.
The Radeon RX 7000 series is notable for its Navi 3x series GPU, which is the first time that a small chip design has been introduced on a consumer graphics card. Among them, Navi 31 and Navi 32 will use MCM multi-chip packages, equipped with one GCD (graphics computing chip) and four or six MCD (multi-cache I/O chips), and will use two different processes at the same time, the former is TSMC’s 5nm, the latter is 6nm.
