According to semiconductor engineering expert Tom Wassick, the AMD Ryzen 7000 processor appears to have received some upgrades in preparation for the upcoming 3D V-Cache model.
Wassick found more TSV columns in the Zen 4 CCD, suggesting that the 3D cached variant of the new Ryzen 7000 processor could provide more bandwidth in hardware than the Ryzen 7 5800X3D this time around.
Through Silicon Vias (TSV) is the latest direction of three-dimensional stacked silicon device technology. Stereoscopic (3D) vertical integration through through-silicon via (TSV) copper interconnects is currently considered one of the most advanced technologies in the semiconductor industry, enabling greater space efficiency and higher interconnect density.
There are said to be two larger, denser arrays of TSVs on the Ryzen 7000 chip, with some spacing reduction — as well as an extra column of TSVs. This means that the Ryzen 7000 3D V-Cache’s substrate will have more contact area with the CPU, resulting in greater L3 cache bandwidth and possible extra power.
3D V-Cache is AMD’s technology for stacking L3 caches, which doubles the L3 cache on its chip by adding 64MB of SRAM cache to Ryzen’s CCD, thereby significantly improving work that is sensitive to L3 cache. Actual performance of loads, especially games.
The only consumer-facing 3D V-Cache chip AMD has released so far is the R7 5800X3D, which has a total of 96MB of L3 cache.
For the additional TSV contacts in the Ryzen 7000 mentioned above, this means that AMD is preparing higher bandwidth performance for its second-generation stack cache, even exceeding the 2Tbps bandwidth of the Ryzen R7 5800X3D.
Some netizens believe that this (extra contacts) may also be one of the reasons for the high power supply of this generation of AMD processors. After all, the extra power can also provide a stronger performance guarantee for V-Cache, but this ultimately depends on AMD By design choice, subsequent 3D models may be more efficient and save more power than current models.
Simply put, these extra TSVs don’t represent how AMD’s next-gen 3D V-Cache will perform, or how much better it must be than the 5800X3D or Ryzen 7000 regular models, it just means that the Ryzen 7000X3D will bring better performance than the 7 5800X3D higher bandwidth.
