AMD’s EPYC Genoa 9000 CPU and SP5 socket with heatsink has been revealed again. As revealed in the leaked specs a few days ago, the next-generation EPYC (Skylar) lineup has up to 96 cores and a maximum 400W TDP.
Sources say the AMD EPYC Genoa 9000 CPU supports new memory and new features. In the company’s latest details, it reports that the SP5 platform will also introduce a new socket with a massive 6096 pins arranged in an LGA socket format. This processor will be AMD’s most significant slot design, adding 2,002 pins to the current LGA 4094 slot set.
AMD is adding more cores to its EPYC Genoa CPU package in order to achieve up to 96 cores, which it will do by integrating up to 12 CCDs. Each CCD will provide 8 cores based on the upcoming new Zen 4 architecture. This is in line with the expanded slot size and will likely see a fairly large CPU meshing layer – more prominent than the current EPYC CPU. The processor reportedly has a 320W TDP and can be configured for up to 400W.
Photos of the socket have been seen online before, but in the most recent photo set, the new design is shown at a higher resolution. Likewise, we also see a picture of the SP5 heatsink, which can be fitted with up to 8 Torx screws.
The next generation of data center AMD EPYC Genoa CPUs will be available in the fourth quarter of 2022 and is expected to be demonstrated before rival Intel announces volume production of its Xeon Sapphire Rapids. It has also been reported that both AMD and Intel processors are available for early deployment and testing by select customers.